Valuation: CHPMS TCHNLGS

Market Cap 76.3B 2.38B 2.08B 1.92B 1.78B 3.38B 227B 3.43B 22.99B 8.95B 111B 8.94B 8.74B 386B P/E 2026 *
25.9x
P/E 2027 * 18.3x
Enterprise Value 79.59B 2.48B 2.17B 2B 1.86B 3.53B 237B 3.58B 23.98B 9.33B 116B 9.32B 9.12B 403B EV / Sales 2026 *
2.59x
EV / Sales 2027 * 2.31x
Free-Float
78.37%
Yield 2026 *
1.13%
Yield 2027 * 1.83%
Manager TitleAgeSince
Director of Finance/CFO 54 2017-09-30
President 67 1997-07-16
Corporate Officer/Principal 60 2007-04-16
Director TitleAgeSince
Chairman 67 1997-07-16
Director/Board Member 67 2007-06-27
Director/Board Member 64 2015-06-02
Change 5-day change 1-year change 3-year change Capi.($)
-7.28%-12.29%+124.81%+135.76% 715B
-6.56%-25.08%+230.78%+425.40% 438B
-3.94%-7.00%+155.64%+239.21% 203B
-4.12%+3.83%+342.86%+500.00% 92.97B
+0.59%-11.72%+1,304.86%+2,021.00% 29.43B
-6.36%-10.47%+136.13%+107.98% 25.97B
-8.11%-25.91%+60.54%+25.90% 22.14B
-4.31%+1.94%+183.77%+330.48% 20.8B
-6.00%-24.71%+202.81%+132.28% 17.32B
Average -5.17%-7.55%+304.69%+435.33% 173.84B
Weighted average by Cap. -6.28%-5.15%+194.54%+287.86%

Financials

2026 *2027 *
Net sales 30.69B 957M 839M 772M 717M 1.36B 91.33B 1.38B 9.24B 3.6B 44.83B 3.6B 3.52B 155B 33.32B 1.04B 910M 839M 778M 1.48B 99.16B 1.5B 10.04B 3.91B 48.67B 3.9B 3.82B 169B
Net income 3.01B 94.02M 82.34M 75.84M 70.4M 134M 8.97B 135M 908M 353M 4.4B 353M 345M 15.26B 4.26B 133M 116M 107M 99.59M 189M 12.69B 192M 1.28B 500M 6.23B 499M 489M 21.59B
Net Debt 3.29B 103M 89.88M 82.79M 76.85M 146M 9.79B 148M 991M 386M 4.81B 385M 377M 16.66B 797M 24.86M 21.78M 20.06M 18.62M 35.35M 2.37B 35.83M 240M 93.44M 1.16B 93.38M 91.33M 4.04B
Logo CHPMS TCHNLGS
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
Employees
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Trader
Investor
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Global
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Quality
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ESG MSCI
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