Valuation: CHPMS TCHNLGS

Market Cap 61.39B 1.93B 1.65B 1.55B 1.41B 2.67B 185B 2.69B 18.28B 7.11B 92.67B 7.24B 7.08B 307B P/E 2026 *
18.9x
P/E 2027 * 13.2x
Enterprise Value 66.25B 2.08B 1.78B 1.67B 1.52B 2.88B 199B 2.91B 19.73B 7.67B 100B 7.81B 7.64B 331B EV / Sales 2026 *
2.19x
EV / Sales 2027 * 1.97x
Free-Float
77.34%
Yield 2026 *
2.5%
Yield 2027 * 4.02%
Manager TitleAgeSince
Chief Executive Officer 67 1997-07-16
Director of Finance/CFO 54 2017-09-30
Chief Operating Officer - 2012-03-05
Director TitleAgeSince
Chairman 67 1997-07-16
Director/Board Member 69 2007-06-27
Director/Board Member 70 2013-06-16
Change 5-day change 1-year change 3-year change Capi.($)
-1.08%-8.11%+130.37%+146.82% 675B
-1.04%-9.71%+206.55%+373.33% 393B
+1.58%-6.73%+174.45%+161.81% 155B
+0.85%-3.90%+312.54%+440.64% 81.07B
-2.97%-14.83%+60.13%+45.94% 21.95B
-0.88%-10.33%+116.95%+62.44% 19.8B
+1.39%-7.88%+131.21%+266.93% 15.43B
-3.16%-19.24%+161.83%+147.13% 14.39B
-4.24%-21.48%+99.30%+81.90% 12.49B
Average -1.07%-8.42%+154.81%+191.88% 154.28B
Weighted average by Cap. -0.70%-5.48%+166.24%+227.70%

Financials

2026 *2027 *
Net sales 30.3B 951M 815M 763M 697M 1.32B 91.08B 1.33B 9.02B 3.51B 45.73B 3.57B 3.49B 151B 35.27B 1.11B 949M 888M 812M 1.53B 106B 1.55B 10.5B 4.08B 53.24B 4.16B 4.07B 176B
Net income 3.28B 103M 88.25M 82.56M 75.48M 142M 9.86B 144M 977M 380M 4.95B 387M 378M 16.38B 4.7B 147M 126M 118M 108M 204M 14.12B 206M 1.4B 544M 7.09B 554M 542M 23.46B
Net Debt 4.86B 153M 131M 122M 112M 211M 14.62B 213M 1.45B 563M 7.34B 573M 561M 24.3B 8.02B 252M 216M 202M 185M 348M 24.1B 352M 2.39B 929M 12.1B 945M 925M 40.05B
Logo CHPMS TCHNLGS
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
Employees
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Global
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ESG MSCI
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