Valuation: CHPMS TCHNLGS

Market Cap 76.3B 2.37B 2.08B 1.91B 1.77B 3.37B 225B 3.42B 22.96B 8.93B 111B 8.91B 8.72B 384B P/E 2026 *
25.9x
P/E 2027 * 18.3x
Enterprise Value 79.59B 2.48B 2.17B 2B 1.85B 3.51B 235B 3.57B 23.95B 9.31B 116B 9.3B 9.1B 401B EV / Sales 2026 *
2.59x
EV / Sales 2027 * 2.31x
Free-Float
78.37%
Yield 2026 *
1.13%
Yield 2027 * 1.83%
Manager TitleAgeSince
President 67 1997-07-16
Director of Finance/CFO 54 2017-09-30
Corporate Officer/Principal 60 2007-04-16
Director TitleAgeSince
Director/Board Member 54 2021-06-30
Chairman 67 1997-07-16
Director/Board Member 67 2007-06-27
Change 5-day change 1-year change 3-year change Capi.($)
-7.28%-12.29%+124.81%+135.76% 715B
-6.87%-24.74%+232.31%+427.83% 438B
-3.94%-7.00%+155.64%+239.21% 203B
-4.12%+3.83%+342.86%+500.00% 92.97B
+0.59%-11.72%+1,304.86%+2,021.00% 29.43B
-6.36%-10.47%+136.13%+107.98% 25.97B
-6.95%-24.85%+62.85%+27.71% 22.14B
-4.31%+1.94%+183.77%+330.48% 20.8B
-6.51%-24.24%+204.71%+133.74% 17.32B
Average -4.34%-11.36%+305.33%+435.97% 173.84B
Weighted average by Cap. -4.46%-12.28%+195.02%+288.58%

Financials

2026 *2027 *
Net sales 30.69B 955M 836M 770M 714M 1.35B 90.62B 1.38B 9.23B 3.59B 44.72B 3.58B 3.51B 155B 33.32B 1.04B 907M 836M 775M 1.47B 98.4B 1.49B 10.03B 3.9B 48.56B 3.89B 3.81B 168B
Net income 3.01B 93.77M 82.06M 75.63M 70.1M 133M 8.9B 135M 907M 353M 4.39B 352M 344M 15.18B 4.26B 133M 116M 107M 99.16M 188M 12.59B 191M 1.28B 499M 6.21B 498M 487M 21.47B
Net Debt 3.29B 102M 89.57M 82.55M 76.51M 145M 9.71B 148M 990M 385M 4.79B 384M 376M 16.57B 797M 24.8M 21.7M 20M 18.54M 35.19M 2.35B 35.76M 240M 93.26M 1.16B 93.1M 91.08M 4.01B
Logo CHPMS TCHNLGS
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
Employees
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Trader
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Global
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Quality
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ESG MSCI
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