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Valuation: CHPMS TCHNLGS

Market Cap 67.9B 2.15B 1.85B 1.71B 1.6B 3B 204B 3.05B 20.24B 7.86B 99.34B 8.06B 7.89B 344B P/E Ratio 2026 *
23x
P/E Ratio 2027 * 16.3x
Enterprise Value 71.19B 2.25B 1.94B 1.79B 1.68B 3.14B 214B 3.2B 21.22B 8.25B 104B 8.45B 8.27B 361B EV / Sales 2026 *
2.32x
EV / Sales 2027 * 2.06x
Free-Float
78.37%
Yield 2026 *
1.27%
Yield 2027 * 2.05%
Manager TitleAgeSince
Director of Finance/CFO 54 2017-09-30
President 67 1997-07-16
Corporate Officer/Principal 60 2007-04-16
Director TitleAgeSince
Chairman 67 1997-07-16
Director/Board Member 67 2007-06-27
Director/Board Member 64 2015-06-02
Change 5-day change 1-year change 3-year change Capi.($)
+3.40%+11.45%+145.20%+139.44% 726B
+7.26%+14.38%+185.71%+241.71% 192B
+8.46%+2.25%+311.15%+360.94% 81.88B
+9.38%+19.04%+1,534.76%+1,908.10% 28.65B
+9.45%+4.31%+201.47%+95.69% 24.62B
+3.86%+20.02%+99.79%+32.31% 22.95B
+8.71%+27.45%+316.19%+205.91% 20.52B
+7.35%+10.41%+173.97%+242.52% 16.46B
+6.70%+27.89%+242.01%+189.80% 16.11B
Average +7.17%+13.19%+356.69%+379.60% 125.42B
Weighted average by Cap. +4.92%+12.06%+204.60%+218.05%

Financials

2026 *2027 *
Net sales 30.69B 971M 838M 772M 723M 1.36B 92.32B 1.38B 9.15B 3.55B 44.9B 3.64B 3.57B 155B 33.32B 1.05B 910M 839M 785M 1.47B 100B 1.5B 9.93B 3.86B 48.75B 3.96B 3.87B 169B
Net income 3.01B 95.34M 82.31M 75.85M 71.04M 133M 9.07B 135M 898M 349M 4.41B 358M 350M 15.26B 4.26B 135M 116M 107M 100M 188M 12.82B 191M 1.27B 494M 6.24B 506M 495M 21.59B
Net Debt 3.29B 104M 89.85M 82.79M 77.54M 145M 9.9B 148M 981M 381M 4.81B 390M 382M 16.66B 797M 25.21M 21.77M 20.06M 18.79M 35.2M 2.4B 35.78M 238M 92.3M 1.17B 94.6M 92.59M 4.04B
Logo CHPMS TCHNLGS
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
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