Valuation: ChipMOS TECHNOLOGIES INC.

Market Cap 64.33B 2.01B 1.74B 1.63B 1.48B 2.79B 192B 2.84B 19.12B 7.48B 96.27B 7.55B 7.38B 320B P/E 2026 *
19.8x
P/E 2027 * 13.8x
Enterprise Value 69.19B 2.16B 1.87B 1.76B 1.6B 3B 207B 3.05B 20.57B 8.04B 104B 8.12B 7.94B 344B EV / Sales 2026 *
2.28x
EV / Sales 2027 * 2.05x
Free-Float
77.34%
Yield 2026 *
2.39%
Yield 2027 * 3.83%
1 day-1.08%
1 week+6.49%
Current month+26.58%
1 month-24.98%
3 months+13.60%
6 months+72.10%
Current year+94.91%
1 week 90.5
Extreme 90.5
99.4
1 month 65.7
Extreme 65.7
109.5
Current year 46.8
Extreme 46.8
125
1 year 23.1
Extreme 23.1
125
3 years 21.3
Extreme 21.3
125
5 years 21.3
Extreme 21.3
125
10 years 20.15
Extreme 20.15
125
Manager TitleAgeSince
Chief Executive Officer 67 1997-07-16
Director of Finance/CFO 54 2017-09-30
Chief Operating Officer - 2012-03-05
Director TitleAgeSince
Chairman 67 1997-07-16
Director/Board Member 69 2007-06-27
Director/Board Member 70 2013-06-16
Change 5-day change 1-year change 3-year change Capi.($)
-1.08%+6.49%+278.97%+157.06% 2.01B
-1.85%+5.38%+148.09%+162.39% 702B
-1.38%+6.75%+234.00%+414.26% 416B
+1.01%+5.30%+183.96%+192.01% 169B
-1.60%+5.30%+316.22%+470.37% 84.66B
-1.25%+6.37%+109.75%+71.27% 24.72B
+0.26%-1.54%+131.68%+84.61% 21.87B
+2.21%+10.74%+160.54%+306.69% 16.97B
-1.81%+7.59%+210.15%+200.22% 16.28B
+2.15%+6.73%+148.27%+132.43% 14.66B
Average -0.31%+3.37%+192.16%+219.13% 146.84B
Weighted average by Cap. -1.23%+5.41%+186.37%+253.98%

Financials

2026 *2027 *
Net sales 30.3B 947M 818M 768M 699M 1.31B 90.54B 1.34B 9B 3.52B 45.34B 3.56B 3.48B 151B 35.27B 1.1B 952M 895M 814M 1.53B 105B 1.55B 10.48B 4.1B 52.78B 4.14B 4.05B 175B
Net income 3.28B 103M 88.53M 83.2M 75.66M 142M 9.8B 145M 975M 381M 4.91B 385M 377M 16.31B 4.7B 147M 127M 119M 108M 204M 14.04B 207M 1.4B 546M 7.03B 551M 539M 23.36B
Net Debt 4.86B 152M 131M 123M 112M 211M 14.54B 214M 1.45B 565M 7.28B 571M 558M 24.19B 8.02B 251M 216M 203M 185M 348M 23.96B 353M 2.38B 932M 12B 941M 920M 39.88B
Logo ChipMOS TECHNOLOGIES INC.
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
Employees
5,688
Date Price Change Volume
26-08-14 NT$91.90 -1.08% 39,986,859
26-08-13 NT$92.90 +0.76% 72,593,049
26-08-12 NT$92.20 -6.87% 86,136,843
26-08-11 NT$99.00 +6.57% 100,567,458
26-08-10 NT$92.90 +7.65% 39,296,241
Trader
Investor
-
Global
-
Quality
-
ESG MSCI
A
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
5
Last Close Price
91.90TWD
Average target price
120.00TWD
Spread / Average Target
+30.58%

Quarterly revenue - Rate of surprise

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