Valuation: ChipMOS TECHNOLOGIES INC.

Market Cap 73.5B 2.3B 2.01B 1.85B 1.72B 3.27B 219B 3.32B 22.18B 8.62B 108B 8.63B 8.45B 371B P/E 2026 *
24.9x
P/E 2027 * 17.7x
Enterprise Value 76.79B 2.4B 2.1B 1.93B 1.8B 3.41B 229B 3.46B 23.17B 9.01B 112B 9.02B 8.83B 388B EV / Sales 2026 *
2.5x
EV / Sales 2027 * 2.23x
Free-Float
78.37%
Yield 2026 *
1.17%
Yield 2027 * 1.9%
Manager TitleAgeSince
Director of Finance/CFO 54 2017-09-30
President 67 1997-07-16
Corporate Officer/Principal 60 2007-04-16
Director TitleAgeSince
Chairman 67 1997-07-16
Director/Board Member 67 2007-06-27
Director/Board Member 64 2015-06-02
Change 5-day change 1-year change 3-year change Capi.($)
-.--%-.--% - - 2.3B
+3.59%+3.56%+147.86%+144.27% 719B
-10.19%-7.30%+255.64%+439.81% 439B
+0.36%+0.38%+169.37%+242.22% 206B
-6.19%+7.91%+363.95%+514.41% 93.65B
-2.44%-12.20%+1,388.62%+2,163.17% 31.4B
-0.19%-4.70%+155.43%+113.63% 26.48B
-11.22%-9.15%+69.28%+33.29% 22.37B
+4.90%+14.54%+214.49%+359.57% 22.21B
-12.93%-11.52%+213.32%+135.78% 17.26B
Average -3.43%-3.55%+330.88%+460.68% 175.4B
Weighted average by Cap. -1.80%-1.75%+218.84%+302.31%

Financials

2026 *2027 *
Net sales 30.69B 960M 839M 771M 719M 1.36B 91.42B 1.38B 9.26B 3.6B 44.94B 3.6B 3.53B 155B 33.32B 1.04B 911M 838M 781M 1.48B 99.27B 1.5B 10.06B 3.91B 48.79B 3.91B 3.83B 168B
Net income 3.01B 94.3M 82.43M 75.76M 70.61M 134M 8.98B 136M 909M 354M 4.41B 354M 346M 15.21B 4.26B 133M 117M 107M 99.89M 189M 12.7B 192M 1.29B 500M 6.24B 501M 490M 21.51B
Net Debt 3.29B 103M 89.98M 82.69M 77.08M 146M 9.8B 148M 993M 386M 4.82B 386M 378M 16.6B 797M 24.94M 21.8M 20.03M 18.67M 35.42M 2.37B 35.96M 241M 93.5M 1.17B 93.6M 91.59M 4.02B
Logo ChipMOS TECHNOLOGIES INC.
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
Employees
5,688
Trader
Investor
-
Global
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Quality
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ESG MSCI
A