Valuation: ChipMOS TECHNOLOGIES INC.

Market Cap 56.7B 1.75B 1.54B 1.43B 1.32B 2.47B 168B 2.51B 17.06B 6.66B 83.03B 6.58B 6.44B 287B P/E 2026 *
18.8x
P/E 2027 * 12.8x
Enterprise Value 60.13B 1.86B 1.63B 1.52B 1.4B 2.62B 178B 2.66B 18.09B 7.07B 88.06B 6.98B 6.83B 304B EV / Sales 2026 *
1.99x
EV / Sales 2027 * 1.78x
Free-Float
77.34%
Yield 2026 *
1.54%
Yield 2027 * 2.56%
Manager TitleAgeSince
President 67 1997-07-16
Director of Finance/CFO 54 2017-09-30
Corporate Officer/Principal 60 2007-04-16
Director TitleAgeSince
Director/Board Member 54 2021-06-30
Chairman 67 1997-07-16
Director/Board Member 67 2007-06-27
Change 5-day change 1-year change 3-year change Capi.($)
-.--%-.--% - - 1.95B
-3.85%-13.68%+118.91%+110.63% 625B
-9.81%-17.97%+167.83%+266.21% 365B
-10.96%-14.10%+100.00%+174.12% 174B
-8.88%-7.20%+260.91%+385.96% 82.52B
-14.05%-10.62%+127.60%+77.11% 23.85B
-5.69%-14.31%+30.55%+10.69% 19.27B
-10.82%-14.14%+132.00%+261.72% 18.36B
-24.45%-29.94%+121.15%+58.51% 15.05B
-11.56%-22.03%+128.95%+90.86% 13.05B
Average -10.02%-4.10%+131.99%+159.53% 148.43B
Weighted average by Cap. -7.33%-5.02%+137.75%+177.66%

Financials

2026 *2027 *
Net sales 30.22B 935M 822M 765M 702M 1.32B 89.64B 1.34B 9.09B 3.55B 44.26B 3.51B 3.43B 153B 34.72B 1.07B 944M 879M 807M 1.52B 103B 1.54B 10.44B 4.08B 50.85B 4.03B 3.94B 176B
Net income 3.05B 94.41M 82.99M 77.26M 70.95M 133M 9.05B 135M 918M 359M 4.47B 354M 347M 15.45B 4.5B 139M 122M 114M 105M 196M 13.35B 199M 1.35B 529M 6.59B 523M 511M 22.78B
Net Debt 3.44B 106M 93.41M 86.95M 79.85M 150M 10.19B 152M 1.03B 404M 5.03B 399M 390M 17.39B 5.24B 162M 143M 133M 122M 229M 15.55B 232M 1.58B 616M 7.68B 609M 595M 26.53B
Logo ChipMOS TECHNOLOGIES INC.
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
Employees
5,688
Trader
Investor
-
Global
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Quality
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ESG MSCI
A