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Valuation: Kinsus Interconnect Technology Corp.

Market Cap 326B 10.3B 8.94B 8.24B 7.72B 14.43B 986B 14.73B 98.31B 38.06B 476B 38.67B 37.84B 1,653B P/E Ratio 2026 *
62.6x
P/E Ratio 2027 * 30.3x
Enterprise Value 323B 10.21B 8.86B 8.17B 7.66B 14.3B 978B 14.6B 97.47B 37.74B 471B 38.35B 37.52B 1,639B EV / Sales 2026 *
6.03x
EV / Sales 2027 * 4.48x
Free-Float
63.17%
Yield 2026 *
0.7%
Yield 2027 * 1.37%
1 day-6.21%
1 week-10.55%
Current month-15.09%
1 month+23.06%
3 months+113.08%
6 months+308.58%
Current year+289.31%
1 week 594
Extreme 594
732
1 month 460
Extreme 460
778
Current year 151.5
Extreme 151.5
778
1 year 80.3
Extreme 80.3
778
3 years 60.8
Extreme 60.8
778
5 years 60.8
Extreme 60.8
778
10 years 30.3
Extreme 30.3
778
Manager TitleAgeSince
Chief Executive Officer - -
Director of Finance/CFO - 2000-07-31
Chief Operating Officer - -
Director TitleAgeSince
Chairman 65 2000-08-31
Chairman - 2000-09-10
Director/Board Member - 2003-08-31
Change 5-day change 1-year change 3-year change Capi.($)
-6.21%-10.55%+576.50%+452.68% 10.99B
-1.68%-7.79%+210.65%+434.69% 210B
+0.48%-3.11%+79.66%+240.93% 92.51B
-0.60%-11.27%+573.01%+787.63% 57.11B
+3.14%+5.49%+483.62%+2,072.71% 55.92B
-1.45%-11.25%+204.64%+1,196.73% 47.57B
-3.39%-12.05%+683.49%+397.96% 44.36B
+2.59%-1.70% - - 40.98B
-1.80%-4.38%+300.34%+540.90% 38.51B
-4.11%-4.05%+258.22%+324.47% 37.83B
Average -1.35%-4.22%+374.46%+716.52% 63.53B
Weighted average by Cap. -0.97%-4.58%+301.18%+651.02%

Financials

2026 *2027 *
Net sales 53.59B 1.69B 1.47B 1.35B 1.27B 2.37B 162B 2.42B 16.15B 6.25B 78.12B 6.35B 6.22B 272B 71.29B 2.25B 1.95B 1.8B 1.69B 3.15B 216B 3.22B 21.49B 8.32B 104B 8.45B 8.27B 361B
Net income 4.87B 154M 133M 123M 115M 215M 14.73B 220M 1.47B 568M 7.1B 577M 565M 24.68B 10.12B 320M 277M 256M 240M 448M 30.62B 457M 3.05B 1.18B 14.76B 1.2B 1.17B 51.31B
Net Debt -2.78B -87.8M -76.19M -70.23M -65.81M -123M -8.41B -126M -838M -324M -4.05B -330M -322M -14.09B -7.08B -224M -194M -179M -168M -313M -21.41B -320M -2.13B -826M -10.32B -840M -821M -35.89B
Logo Kinsus Interconnect Technology Corp.
Kinsus Interconnect Technology Corp is a Taiwan-based company principally engaged in the manufacture and distribution of substrates and printed circuit boards (PCBs). The main products portfolio consists of plastic ball grid array (BGA) substrates, multi-chip-module (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, high dissipation cavity down substrates and thermal enhanced-BGA (TEBGA) substrates, flip chip substrates, flip chip CSP substrates and others. Its products are raw materials or carrier components in the packaging industry and are used as chip carriers during semiconductor assembly and as channels for external circuit connections. The Company sells products domestic and foreign integrated circuit (IC) packaging, design, and system companies. The Company distributes products in Taiwan, Mainland China, the United States, Japan, Europe, and other markets.
Employees
-
Date Price Change Volume
26-06-11 619.00 NT$ -6.21% 31,037,940
26-06-10 660.00 NT$ -7.56% 6,573,701
26-06-09 714.00 NT$ +2.29% 5,537,626
26-06-08 698.00 NT$ -1.97% 8,137,218
26-06-05 712.00 NT$ +2.89% 7,602,120
Trader
Investor
Global
Quality
ESG MSCI
B
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
11
Last Close Price
619.00TWD
Average target price
541.91TWD
Spread / Average Target
-12.45%

Quarterly revenue - Rate of surprise

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