Valuation: Kinsus Interconnect Technology Corp.

Market Cap 444B 13.76B 11.92B 11.16B 10.19B 19.17B 1,312B 19.49B 131B 51.28B 657B 51.66B 50.54B 2,192B P/E 2026 *
78.9x
P/E 2027 * 34.5x
Enterprise Value 445B 13.8B 11.96B 11.2B 10.22B 19.22B 1,316B 19.55B 131B 51.44B 659B 51.82B 50.69B 2,198B EV / Sales 2026 *
8.34x
EV / Sales 2027 * 5.68x
Free-Float
60.37%
Yield 2026 *
0.56%
Yield 2027 * 1.34%
1 day+0.72%
1 week+9.78%
Current month+32.60%
1 month+5.91%
3 months+67.40%
6 months+217.14%
Current year+429.56%
1 week 801
Extreme 801
854
1 month 541
Extreme 541
859
Current year 151.5
Extreme 151.5
939
1 year 101
Extreme 101
939
3 years 60.8
Extreme 60.8
939
5 years 60.8
Extreme 60.8
939
10 years 30.3
Extreme 30.3
939
Manager TitleAgeSince
Chief Executive Officer - -
Corporate Officer/Principal - 2022-04-30
Director of Finance/CFO - 2000-07-31
Director TitleAgeSince
Director/Board Member 65 2000-08-31
Chairman - 2000-09-10
Director/Board Member - -
Change 5-day change 1-year change 3-year change Capi.($)
+0.72%+9.78%+705.74%+698.10% 13.65B
+1.52%+4.01%+196.68%+492.05% 196B
+2.99%-1.03%+31.57%+281.52% 98.4B
+4.63%+7.68%+379.22%+1,266.67% 58.74B
0.00%+7.36%+596.14%+468.48% 50.43B
+4.26%+8.25%+248.44%+833.86% 50.23B
-1.70%+0.98% - - 42.4B
-4.01%+36.04%+35.60%+1,185.85% 40.56B
+2.23%+14.48%+174.85%+568.17% 37.6B
-1.39%+8.26%+132.56%+468.88% 35B
Average +0.93%+10.58%+277.87%+695.95% 62.29B
Weighted average by Cap. +1.44%+13.25%+221.78%+619.14%

Financials

2026 *2027 *
Net sales 53.35B 1.65B 1.43B 1.34B 1.22B 2.3B 158B 2.34B 15.74B 6.17B 78.99B 6.21B 6.08B 264B 78.09B 2.42B 2.1B 1.96B 1.79B 3.37B 231B 3.43B 23.04B 9.03B 116B 9.09B 8.9B 386B
Net income 5.39B 167M 145M 136M 124M 233M 15.96B 237M 1.59B 624M 7.99B 628M 615M 26.65B 12.67B 393M 341M 319M 291M 547M 37.48B 557M 3.74B 1.46B 18.76B 1.48B 1.44B 62.59B
Net Debt 1.33B 41.34M 35.83M 33.54M 30.6M 57.59M 3.94B 58.55M 393M 154M 1.97B 155M 152M 6.58B 271M 8.4M 7.28M 6.82M 6.22M 11.7M 801M 11.9M 79.91M 31.31M 401M 31.54M 30.85M 1.34B
Logo Kinsus Interconnect Technology Corp.
Kinsus Interconnect Technology Corp is a Taiwan-based company principally engaged in the manufacture and distribution of substrates and printed circuit boards (PCBs). The main products portfolio consists of plastic ball grid array (BGA) substrates, multi-chip-module (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, high dissipation cavity down substrates and thermal enhanced-BGA (TEBGA) substrates, flip chip substrates, flip chip CSP substrates and others. Its products are raw materials or carrier components in the packaging industry and are used as chip carriers during semiconductor assembly and as channels for external circuit connections. The Company sells products domestic and foreign integrated circuit (IC) packaging, design, and system companies. The Company distributes products in Taiwan, Mainland China, the United States, Japan, Europe, and other markets.
Employees
-
Date Price Change Volume
26-08-11 NT$842.00 +0.72% 2,961,490
26-08-10 NT$836.00 +1.58% 3,650,916
26-08-07 NT$823.00 -3.52% 16,107,601
26-08-06 NT$853.00 +3.02% 23,356,386
26-08-05 NT$828.00 +7.95% 33,103,524
Trader
Investor
Global
Quality
ESG MSCI
B
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
13
Last Close Price
842.00TWD
Average target price
938.92TWD
Spread / Average Target
+11.51%

Quarterly revenue - Rate of surprise

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