Valuation: Kinsus Interconnect Technology Corp.

Market Cap 433B 13.2B 11.79B 10.83B 9.84B 18.47B 1,250B 18.94B 129B 52.01B 660B 49.54B 48.48B 2,092B P/E 2026 *
63.4x
P/E 2027 * 28.1x
Enterprise Value 441B 13.42B 11.99B 11.02B 10.01B 18.79B 1,272B 19.26B 131B 52.9B 671B 50.39B 49.31B 2,127B EV / Sales 2026 *
8.12x
EV / Sales 2027 * 5.25x
Free-Float
60.38%
Yield 2026 *
0.77%
Yield 2027 * 1.86%
1 day+0.37%
1 week-12.65%
Current month-11.80%
1 month-21.71%
3 months+17.77%
6 months+55.68%
Current year+416.98%
1 week 754
Extreme 754
1,020
1 month 754
Extreme 754
1,150
Current year 151.5
Extreme 151.5
1,150
1 year 125.5
Extreme 125.5
1,150
3 years 60.8
Extreme 60.8
1,150
5 years 60.8
Extreme 60.8
1,150
10 years 30.3
Extreme 30.3
1,150
Manager TitleAgeSince
Chief Executive Officer - -
Corporate Officer/Principal - 2022-04-30
Director of Finance/CFO - 2000-07-31
Director TitleAgeSince
Director/Board Member 65 2000-08-31
Chairman - 2000-09-10
Director/Board Member - -
Change 5-day change 1-year change 3-year change Capi.($)
+0.37%-12.65%+491.37%+732.83% 13.15B
-1.86%-6.01%+1.88%+342.46% 4,991B
-1.53%-5.83%+49.67%+311.66% 1,814B
-1.42%-7.15%-7.19%+270.84% 1,585B
-5.89%-17.91%+270.19%+1,006.86% 967B
-0.14%+4.10%+125.16%+1,009.70% 758B
+0.41%-16.23%+93.80%+333.64% 790B
+13.63%+2.53% - - 395B
-4.38%-39.64%+55.71%+51.94% 322B
-0.43%+0.46%+95.31%+111.02% 286B
Average -0.10%-9.03%+130.66%+463.44% 1,192B
Weighted average by Cap. -1.28%-6.47%+49.46%+413.40%

Financials

2026 *2027 *
Net sales 54.23B 1.65B 1.48B 1.36B 1.23B 2.31B 157B 2.37B 16.19B 6.51B 82.62B 6.2B 6.07B 262B 83.74B 2.55B 2.28B 2.09B 1.9B 3.57B 242B 3.66B 25B 10.06B 128B 9.58B 9.37B 404B
Net income 6.85B 209M 186M 171M 155M 292M 19.76B 299M 2.04B 822M 10.43B 783M 766M 33.06B 16.67B 508M 454M 417M 379M 711M 48.12B 729M 4.98B 2B 25.4B 1.91B 1.87B 80.5B
Net Debt 7.39B 225M 201M 185M 168M 315M 21.33B 323M 2.21B 887M 11.26B 845M 827M 35.69B 6.67B 203M 182M 167M 152M 285M 19.26B 292M 1.99B 801M 10.16B 763M 747M 32.21B
Projected Income Statement - Annual - Kinsus Interconnect Technology Corp.
Logo Kinsus Interconnect Technology Corp.
Kinsus Interconnect Technology Corp is a Taiwan-based company principally engaged in the manufacture and distribution of substrates and printed circuit boards (PCBs). The main products portfolio consists of plastic ball grid array (BGA) substrates, multi-chip-module (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, high dissipation cavity down substrates and thermal enhanced-BGA (TEBGA) substrates, flip chip substrates, flip chip CSP substrates and others. Its products are raw materials or carrier components in the packaging industry and are used as chip carriers during semiconductor assembly and as channels for external circuit connections. The Company sells products domestic and foreign integrated circuit (IC) packaging, design, and system companies. The Company distributes products in Taiwan, Mainland China, the United States, Japan, Europe, and other markets.
Employees
-
Date Price Change Volume
26-11-03 NT$822.00 +0.37% 20,691,470
26-11-03 NT$819.00 -10.00% 18,122,609
26-11-02 NT$910.00 -2.36% 17,344,176
26-10-30 NT$932.00 -2.82% 15,700,565
26-10-29 NT$959.00 -7.34% 18,205,518
Trader
Investor
Global
Quality
ESG MSCI
B
MarketScreener Ratings - Kinsus Interconnect Technology Corp.
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
13
Last Close Price
822.00TWD
Average target price
1,221.00TWD
Spread / Average Target
+48.54%

Quarterly revenue - Rate of surprise

Rate of surprise - Net sales - Quarterly - Kinsus Interconnect Technology Corp.
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