Valuation : Kinsus Interconnect Technology Corp.

Market Cap 432B 13.61B 11.72B 11B 10.04B 18.87B 1,295B 19B 130B 50.72B 657B 51.1B 49.99B 2,174B P/E 2026 *
77.4x
P/E 2027 * 33.2x
Enterprise Value 433B 13.65B 11.75B 11.04B 10.07B 18.92B 1,299B 19.06B 131B 50.88B 659B 51.25B 50.14B 2,181B EV / Sales 2026 *
8.3x
EV / Sales 2027 * 5.5x
Free-Float
60.38%
Yield 2026 *
0.57%
Yield 2027 * 1.39%
1 day-8.90%
1 week+0.99%
Current month+28.98%
1 month+41.70%
3 months+12.35%
6 months+168.97%
Current year+415.09%
1 week 766
Extreme 766
960
1 month 694
Extreme 694
960
Current year 151.5
Extreme 151.5
960
1 year 102
Extreme 102
960
3 years 60.8
Extreme 60.8
960
5 years 60.8
Extreme 60.8
960
10 years 30.3
Extreme 30.3
960
Manager TitleAgeSince
Chief Executive Officer - -
Corporate Officer/Principal - 2022-04-30
Director of Finance/CFO - 2000-07-31
Director TitleAgeSince
Director/Board Member 65 2000-08-31
Chairman - 2000-09-10
Director/Board Member - -
Change 5-day change 1-year change 3-year change Capi.($)
-8.90%+0.99%+621.59%+676.30% 13.61B
-1.51%+3.56%+186.50%+453.60% 198B
-2.69%+3.15%+8.17%+249.49% 103B
-0.09%-3.43%+349.59%+1,220.10% 61.98B
-10.00%-7.93%+591.35%+442.93% 51.68B
+1.22%-1.53%+199.91%+938.28% 53.67B
+2.42%-1.26% - - 41.13B
+1.84%+3.02%+86.40%+628.19% 37.39B
+2.64%+3.05%+81.58%+487.26% 35.75B
+0.64%-4.18%-9.04%+1,019.43% 34.64B
Average -1.44%+2.44%+235.12%+679.51% 63.04B
Weighted average by Cap. -1.38%+3.27%+195.04%+593.26%

Financials

2026 *2027 *
Net sales 52.15B 1.64B 1.42B 1.33B 1.21B 2.28B 156B 2.3B 15.75B 6.13B 79.34B 6.17B 6.04B 263B 78.56B 2.48B 2.13B 2B 1.83B 3.43B 236B 3.46B 23.73B 9.23B 120B 9.3B 9.1B 396B
Net income 5.4B 170M 147M 138M 126M 236M 16.19B 238M 1.63B 634M 8.21B 639M 625M 27.18B 12.92B 407M 351M 329M 301M 565M 38.75B 569M 3.9B 1.52B 19.65B 1.53B 1.5B 65.07B
Net Debt 1.33B 42.03M 36.19M 33.98M 31.02M 58.27M 4B 58.69M 403M 157M 2.03B 158M 154M 6.72B 271M 8.54M 7.35M 6.91M 6.3M 11.84M 813M 11.93M 81.83M 31.84M 412M 32.07M 31.37M 1.36B
Logo Kinsus Interconnect Technology Corp.
Kinsus Interconnect Technology Corp is a Taiwan-based company principally engaged in the manufacture and distribution of substrates and printed circuit boards (PCBs). The main products portfolio consists of plastic ball grid array (BGA) substrates, multi-chip-module (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, high dissipation cavity down substrates and thermal enhanced-BGA (TEBGA) substrates, flip chip substrates, flip chip CSP substrates and others. Its products are raw materials or carrier components in the packaging industry and are used as chip carriers during semiconductor assembly and as channels for external circuit connections. The Company sells products domestic and foreign integrated circuit (IC) packaging, design, and system companies. The Company distributes products in Taiwan, Mainland China, the United States, Japan, Europe, and other markets.
Employees
-
Date Price Change Volume
26-08-31 NT$819.00 -8.90% 31,905,413
26-08-28 NT$899.00 -1.64% 21,576,121
26-08-27 NT$914.00 +3.75% 32,580,788
26-08-26 NT$881.00 +5.51% 23,277,987
26-08-25 NT$835.00 +5.16% 11,433,628
Trader
Investor
Global
Quality
ESG MSCI
B
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
13
Last Close Price
819.00TWD
Average target price
952.77TWD
Spread / Average Target
+16.33%

Quarterly revenue - Rate of surprise

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