Business description: Kinsus Interconnect Technology Corp.

Kinsus Interconnect Technology Corp is a Taiwan-based company principally engaged in the manufacture and distribution of substrates and printed circuit boards (PCBs). The main products portfolio consists of plastic ball grid array (BGA) substrates, multi-chip-module (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, high dissipation cavity down substrates and thermal enhanced-BGA (TEBGA) substrates, flip chip substrates, flip chip CSP substrates and others. Its products are raw materials or carrier components in the packaging industry and are used as chip carriers during semiconductor assembly and as channels for external circuit connections. The Company sells products domestic and foreign integrated circuit (IC) packaging, design, and system companies. The Company distributes products in Taiwan, Mainland China, the United States, Japan, Europe, and other markets.

Sales by Activity: Kinsus Interconnect Technology Corp.

Fiscal Period: December 2021 (TWD) 2022 (TWD) 2023 (TWD) 2024 (TWD) 2025 (TWD)

IC Substrate

27.73B 35.3B 20.04B 23.72B 32.31B

Optics

5.6B 6.32B 6.79B 6.82B 7.04B

Elimination

- - - - -158K

Printed Circuit Board (PCB)

2.34B 2.82M - - -

Geographical breakdown of sales: Kinsus Interconnect Technology Corp.

Fiscal Period: December 2021 (TWD) 2022 (TWD) 2023 (TWD) 2024 (TWD) 2025 (TWD)

Other Countries

23.13B 29.37B 20.03B 22.04B 29.26B

Taiwan

12.54B 13.07B 6.8B 8.5B 10.09B

Executive Committee: Kinsus Interconnect Technology Corp.

Manager TitleAgeSince
Chief Executive Officer - -
Director of Finance/CFO - 2000-07-31
Chief Operating Officer - -
Chief Tech/Sci/R&D Officer - 2000-09-10
Corporate Officer/Principal 65 2013-10-31

Composition of the Board of Directors: Kinsus Interconnect Technology Corp.

Director TitleAgeSince
Chairman 65 2000-08-31
Chairman - 2000-09-10
Director/Board Member - 2003-08-31
Director/Board Member - 2003-08-31
Director/Board Member - -
Director/Board Member - 2000-09-10
Director/Board Member - 2010-06-17
Director/Board Member - 2003-08-31
Director/Board Member - 2003-08-31
Director/Board Member - -

Shareholders: Kinsus Interconnect Technology Corp.

NameStocks%Valuation
34.14 %
179,895,455 34.14 % 4 186 M NT$
Fuh Hwa Securities Investment Trust Co., Ltd.
1.336 %
7,040,920 1.336 % 164 M NT$
Nomura Asset Management Taiwan Ltd.
1.221 %
6,435,388 1.221 % 150 M NT$
Uni-President Asset Management Corp.
0.852 %
4,489,108 0.852 % 104 M NT$
Neuberger Berman Taiwan Ltd.
0.309 %
1,627,999 0.309 % 38 M NT$

Holdings: Kinsus Interconnect Technology Corp.

NameStocks%Valuation
21,233,73627.22% 218 M $

Company details: Kinsus Interconnect Technology Corp.

Kinsus Interconnect Technology Corp.

No. 1245 Zhonghua Road

327 47, Taoyuan

+

http://www.kinsus.com.tw
address Kinsus Interconnect Technology Corp.(3189)

Integrated Circuits

Change 5-day change 1-year change 3-year change Capi.($)
+9.94%+30.49%+866.02%+589.18% 12.05B
+1.71%+6.82%+257.20%+544.30% 221B
+3.14%+10.12%+99.75%+285.82% 100B
-0.90%+24.36%+645.32%+917.87% 73.52B
+4.02%+20.60%+595.11%+2,322.04% 63.4B
-0.98%+11.67%+221.54%+1,405.56% 53.35B
+3.82%+11.42%+905.00%+437.43% 48.58B
+0.78%+20.51%+360.89%+666.85% 45.67B
-1.54%+9.08% - - 45.51B
-1.78%+16.02%+236.17%+572.81% 42.05B
Average +1.82%+9.26%+465.22%+860.21% 70.58B
Weighted average by Cap. +1.45%+6.28%+370.67%+790.17%
Trader
Investor
Global
Quality
ESG MSCI
B
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
12
Last Close Price
796.00TWD
Average target price
563.42TWD
Spread / Average Target
-29.22%

Quarterly revenue - Rate of surprise

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  3. 3189 Stock
  4. Company Kinsus Interconnect Technology Corp.
-40%: Exceptional extension
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