Valuation: CPS Technologies Corporation

Market Cap 74.45M 66.15M 61.74M 56.27M 106M 7.16B 107M 747M 290M 3.66B 280M 273M 11.74B P/E 2026 *
384x
P/E 2027 * 64x
Enterprise Value 74.45M 66.15M 61.74M 56.27M 106M 7.16B 107M 747M 290M 3.66B 280M 273M 11.74B EV / Sales 2026 *
2.3x
EV / Sales 2027 * 2.15x
Free-Float
81.52%
Yield 2026 *
-
Yield 2027 * -
Manager TitleAgeSince
Chief Executive Officer 56 2023-08-13
Director of Finance/CFO - 2026-05-17
Chief Tech/Sci/R&D Officer - 2023-04-30
Director TitleAgeSince
Director/Board Member 71 1992-08-31
Chairman 75 2018-06-20
Director/Board Member 54 2007-12-31
Change 5-day change 1-year change 3-year change Capi.($)
+1.54%-0.79%+14.47%+105.37% 239B
+1.50%-0.81%-27.58%+43.38% 203B
+3.55%+4.12%+20.96%+95.76% 192B
-0.27%-0.88%+15.75%+107.43% 169B
-1.05%-1.31%+110.85%+461.85% 154B
+1.08%+2.08%+9.53%+134.18% 102B
-0.76%-0.76%+51.30%+200.00% 96.97B
+2.46%-0.43%+56.01%+556.55% 97.09B
+2.95%+4.02%+43.79%+198.28% 94.64B
Average +0.99%+0.79%+32.79%+211.42% 149.75B
Weighted average by Cap. +1.13%+0.38%+27.53%+183.58%

Financials

2026 *2027 *
Net sales 32.33M 28.73M 26.81M 24.44M 46.09M 3.11B 46.52M 324M 126M 1.59B 121M 119M 5.1B 34.67M 30.8M 28.75M 26.21M 49.42M 3.33B 49.88M 348M 135M 1.7B 130M 127M 5.47B
Net income 200K 178K 166K 151K 285K 19.23M 288K 2.01M 778K 9.83M 751K 735K 31.54M 1.08M 960K 896K 816K 1.54M 104M 1.55M 10.84M 4.2M 53.08M 4.05M 3.97M 170M
Net Debt - -
Logo CPS Technologies Corporation
CPS Technologies Corp. is an advanced materials company. It designs, manufactures, and sells high-performance material solutions to global customers in transportation, energy, automotive, electronics, telecommunications, aerospace, and defense. The Company specializes in proprietary metal matrix composites (MMCs), combining metals and ceramics to deliver superior strength, thermal management, and reliability for demanding applications, such as high-speed rail, HVDC systems, mass transit, electric vehicles, internet equipment, and electrical infrastructure. It also produces hermetic packaging for high-reliability power and communications modules, supporting avionics, GPS, microprocessors, and specialized integrated circuits. Additionally, its lightweight HybridTech Armor provides high strength-to-weight protection. Key proprietary manufacturing processes include the Company's Quickset Injection Molding Process and QuickCast Pressure Infiltration Process.
Employees
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