Valuation: CPS Technologies Corporation

Market Cap 79.95M 70.22M 65.3M 59.92M 113M 7.7B 114M 775M 303M 3.79B 300M 294M 13.09B P/E 2026 *
111x
P/E 2027 * 24.7x
Enterprise Value 79.95M 70.22M 65.3M 59.92M 113M 7.7B 114M 775M 303M 3.79B 300M 294M 13.09B EV / Sales 2026 *
2.29x
EV / Sales 2027 * 1.89x
Free-Float
81.71%
Yield 2026 *
-
Yield 2027 * -
Manager TitleAgeSince
Chief Executive Officer 56 2023-08-13
Director of Finance/CFO - 2026-05-17
Chief Tech/Sci/R&D Officer - 2023-04-30
Director TitleAgeSince
Chairman 75 2018-06-20
Director/Board Member 71 1992-08-31
Director/Board Member 82 2019-08-19
Change 5-day change 1-year change 3-year change Capi.($)
-0.77%+6.39%+35.43%+68.98% 265B
+1.51%+2.91%+19.78%+80.44% 238B
+1.00%+2.13%+13.46%+67.30% 171B
-2.66%+1.02%+3.03%+99.01% 157B
-5.05%+2.59%+245.26%+395.15% 143B
-0.97%+2.33%+115.44%+181.65% 114B
-4.50%+0.28%+111.22%+1,045.86% 112B
+2.10%+6.02%-1.13%+60.13% 82.86B
+0.34%+2.10%+34.36%+52.41% 55.46B
Average -1.00%+2.77%+64.09%+227.88% 148.71B
Weighted average by Cap. -0.92%+2.59%+59.31%+199.00%

Financials

2026 *2027 *
Net sales 34.98M 30.72M 28.57M 26.22M 49.26M 3.37B 50.02M 339M 133M 1.66B 131M 128M 5.73B 42.28M 37.13M 34.53M 31.69M 59.54M 4.07B 60.46M 410M 160M 2B 159M 155M 6.92B
Net income 630K 553K 515K 472K 887K 60.67M 901K 6.11M 2.39M 29.83M 2.37M 2.31M 103M 3.3M 2.9M 2.7M 2.47M 4.65M 318M 4.72M 32.01M 12.51M 156M 12.39M 12.12M 540M
Net Debt - -
Logo CPS Technologies Corporation
CPS Technologies Corp. is an advanced materials company. It designs, manufactures, and sells high-performance material solutions to global customers in transportation, energy, automotive, electronics, telecommunications, aerospace, and defense. The Company specializes in proprietary metal matrix composites (MMCs), combining metals and ceramics to deliver superior strength, thermal management, and reliability for demanding applications, such as high-speed rail, HVDC systems, mass transit, electric vehicles, internet equipment, and electrical infrastructure. It also produces hermetic packaging for high-reliability power and communications modules, supporting avionics, GPS, microprocessors, and specialized integrated circuits. Additionally, its lightweight HybridTech Armor provides high strength-to-weight protection. Key proprietary manufacturing processes include the Company's Quickset Injection Molding Process and QuickCast Pressure Infiltration Process.
Employees
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