Valuation: Kinsus Interconnect Technology Corp.

Market Cap 390B 11.88B 10.7B 9.88B 8.94B 16.91B 1,113B 17.36B 118B 47.19B 598B 44.59B 43.63B 1,897B P/E 2026 *
57.2x
P/E 2027 * 24.1x
Enterprise Value 398B 12.11B 10.91B 10.07B 9.11B 17.23B 1,134B 17.69B 121B 48.08B 609B 45.43B 44.46B 1,933B EV / Sales 2026 *
7.32x
EV / Sales 2027 * 4.74x
Free-Float
60.38%
Yield 2026 *
0.95%
Yield 2027 * 2.07%
1 day-0.54%
1 week-9.52%
Current month-20.49%
1 month-31.07%
3 months-11.36%
6 months+61.79%
Current year+366.04%
1 week 666
Extreme 666
787
1 month 666
Extreme 666
1,085
Current year 151.5
Extreme 151.5
1,150
1 year 126
Extreme 126
1,150
3 years 60.8
Extreme 60.8
1,150
5 years 60.8
Extreme 60.8
1,150
10 years 30.3
Extreme 30.3
1,150
Manager TitleAgeSince
Chief Executive Officer - -
Corporate Officer/Principal - 2022-04-30
Director of Finance/CFO - 2000-07-31
Director TitleAgeSince
Director/Board Member 65 2000-08-31
Chairman - 2000-09-10
Director/Board Member - -
Change 5-day change 1-year change 3-year change Capi.($)
-0.54%-9.52%+478.91%+697.63% 11.87B
+2.87%-15.95%-12.72%+259.43% 4,078B
+4.81%+4.36%+62.37%+329.98% 1,792B
+3.99%+3.94%-3.67%+260.54% 1,585B
+7.32%+14.26%+126.62%+366.23% 845B
+11.89%-5.12%+220.29%+976.57% 820B
+5.36%-8.66%+110.73%+878.54% 657B
+4.00%+8.43% - - 411B
+7.52%+3.22%+62.55%+60.83% 309B
+3.09%-0.86%+92.93%+110.48% 275B
Average +0.74%-2.79%+126.44%+437.80% 1,078B
Weighted average by Cap. -0.92%-6.61%+44.84%+367.08%

Financials

2026 *2027 *
Net sales 54.32B 1.65B 1.49B 1.37B 1.24B 2.35B 155B 2.42B 16.46B 6.56B 83.14B 6.2B 6.07B 264B 83.74B 2.55B 2.3B 2.12B 1.92B 3.63B 239B 3.72B 25.37B 10.12B 128B 9.56B 9.36B 407B
Net income 6.85B 208M 188M 173M 157M 297M 19.52B 304M 2.07B 827M 10.48B 782M 765M 33.27B 16.67B 507M 457M 422M 382M 722M 47.52B 741M 5.05B 2.01B 25.51B 1.9B 1.86B 81B
Net Debt 7.39B 225M 203M 187M 169M 320M 21.07B 329M 2.24B 893M 11.31B 844M 826M 35.91B 6.67B 203M 183M 169M 153M 289M 19.02B 297M 2.02B 806M 10.21B 762M 745M 32.41B
Projected Income Statement - Annual - Kinsus Interconnect Technology Corp.
Logo Kinsus Interconnect Technology Corp.
Kinsus Interconnect Technology Corp is a Taiwan-based company principally engaged in the manufacture and distribution of substrates and printed circuit boards (PCBs). The main products portfolio consists of plastic ball grid array (BGA) substrates, multi-chip-module (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, high dissipation cavity down substrates and thermal enhanced-BGA (TEBGA) substrates, flip chip substrates, flip chip CSP substrates and others. Its products are raw materials or carrier components in the packaging industry and are used as chip carriers during semiconductor assembly and as channels for external circuit connections. The Company sells products domestic and foreign integrated circuit (IC) packaging, design, and system companies. The Company distributes products in Taiwan, Mainland China, the United States, Japan, Europe, and other markets.
Employees
-
Date Price Change Volume
26-11-11 NT$741.00 -0.54% 12,649,345
26-11-10 NT$745.00 +7.97% 8,517,090
26-11-09 NT$690.00 +2.83% 45,091,586
26-11-06 NT$671.00 -9.32% 15,577,678
26-11-05 NT$740.00 -9.98% 18,032,272
Trader
Investor
Global
Quality
ESG MSCI
B
MarketScreener Ratings - Kinsus Interconnect Technology Corp.
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
13
Last Close Price
741.00TWD
Average target price
1,221.00TWD
Spread / Average Target
+64.78%
  1. Stock Market
  2. Stocks
  3. 3189 Stock