Valuation: Strasbaugh

Market Cap 10M 8.8M 8.18M 7.51M 14.09M 966M 14.33M 97.11M 38.07M 473M 37.54M 36.73M 1.64B P/E 2008
-2.77x
P/E 2009 -1.14x
Enterprise Value 8.76M 7.71M 7.16M 6.58M 12.34M 846M 12.55M 85.07M 33.35M 415M 32.88M 32.17M 1.43B EV / Sales 2008
1.77x
EV / Sales 2009 0.29x
Free-Float
100%
Yield 2008 *
-
Yield 2009 -
Manager TitleAgeSince
Chief Executive Officer 76 2007-04-30
Director TitleAgeSince
Chairman 76 2007-04-30
Change 5-day change 1-year change 3-year change Capi.($)
-45.39%-.--% - - 14
-4.72%-4.40%+186.75%+293.15% 447B
+2.30%+7.72%+128.36%+279.37% 79.28B
+3.54%+7.49%+191.60%+333.93% 53.06B
-1.63%-5.14%+90.60%+121.81% 48.56B
-12.27%-13.74%+42.90%+162.40% 45.94B
+6.46%+9.56%+351.05%+449.08% 31.75B
-5.94%-8.09%+33.39%-16.03% 31.23B
-1.26%-3.90%+83.58%+113.95% 20.69B
+2.68%-6.97%+152.56%+199.81% 20.8B
Average -5.06%+4.56%+140.09%+215.27% 86.46B
Weighted average by Cap. +0.26%+0.26%+163.53%+262.81%

Financials

2008 2009
Net sales 9.55M 8.41M 7.81M 7.17M 13.46M 922M 13.69M 92.78M 36.37M 452M 35.86M 35.09M 1.56B 12.87M 11.33M 10.53M 9.67M 18.14M 1.24B 18.45M 125M 49M 609M 48.32M 47.28M 2.11B
Net income -4.51M -3.97M -3.69M -3.38M -6.35M -435M -6.46M -43.78M -17.16M -213M -16.92M -16.56M -738M -680K -598K -556K -511K -958K -65.66M -974K -6.6M -2.59M -32.18M -2.55M -2.5M -111M
Net Debt -0.19 -0.17 -0.15 -0.14 -0.26 -18.15 -0.27 -1.83 -0.72 -8.9 -0.71 -0.69 -30.79 -1.24 -1.09 -1.01 -0.93 -1.75 -119.72 -1.78 -12.04 -4.72 -58.69 -4.65 -4.55 -203.1
Logo Strasbaugh
Strasbaugh design and manufacturing of advanced surfacing technology for the global Semiconductor, Silicon, Data Storage, micro-electromechanical system (MEMS), ), light emitting diode (LED), Telecommunications and Precision Optics industries. The products are used by the customers in the fabrication of integrated circuits, known as chips or semiconductors, and in the fabrication of silicon wafers. The semiconductors are built on a silicon wafer base and include a range of circuit components, which are connected by multiple layers of wiring or interconnect. The Company’s products are STB P300- 300mm Production CMP and Silicon Polishing System: 2 spindel, 3 table polishing system; 6EG -300mm CMP System: 1 spindle, 1 table CMP system; 6EC- 200mm CMP System: 1 spindle, 1 table CMP system; 6DS-SP - 200mm CMP System: 2 spindles, 2 table auto-loading CMP system; 7AF, 7AF-SP & 7AA-II - 200mm & 150mm Wafer Grinders, and 6DZ - 200mm Prime Wafer Polisher.
Employees
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