Valuation : Strasbaugh

Market Cap 10M 8.6M 8.09M 7.38M 13.78M 948M 13.85M 95.84M 37.08M 485M 37.55M 36.73M 1.54B P/E 2008
-2.77x
P/E 2009 -1.14x
Enterprise Value 8.76M 7.53M 7.09M 6.47M 12.07M 830M 12.13M 83.95M 32.48M 424M 32.89M 32.18M 1.35B EV / Sales 2008
1.77x
EV / Sales 2009 0.29x
Free-Float
100%
Yield 2008 *
-
Yield 2009 -
1 week+909,900.00%
Current month+909,900.00%
1 month+909,900.00%
3 months+909,900.00%
6 months+909,900.00%
Current year+909,900.00%
5 years 0
Extreme 1.0E-6
0.01
10 years 0
Extreme 1.0E-6
0.51
Manager TitleAgeSince
Chief Executive Officer 76 2007-04-30
Director TitleAgeSince
Chairman 76 2007-04-30
Change 5-day change 1-year change 3-year change Capi.($)
-.--%+909,900.00%+909,900.00%+909,900.00% 14
+3.98%+7.00%+191.76%+220.47% 361B
-1.93%-2.97%+74.91%+228.19% 71.43B
-2.44%+7.02%+99.10%+94.47% 49.11B
-2.32%-4.14%+135.38%+231.56% 49.09B
+1.17%-0.92%+44.68%+100.85% 40.18B
-3.06%-2.85%+257.75%+291.05% 28.11B
-0.27%+2.64%+36.93%-22.25% 24.81B
-0.20%-1.39%+91.67%+157.04% 20.21B
-3.60%+3.20%+76.09%+86.70% 19.03B
Average -1.32%+0.18%+91,090.83%+91,128.81% 66.28B
Weighted average by Cap. -1.18%-0.80%+149.84%+193.67%

Financials

2008 2009
Net sales 9.55M 8.21M 7.73M 7.05M 13.16M 906M 13.23M 91.57M 35.43M 463M 35.88M 35.09M 1.47B 12.87M 11.07M 10.41M 9.5M 17.73M 1.22B 17.83M 123M 47.73M 624M 48.34M 47.28M 1.99B
Net income -4.51M -3.88M -3.65M -3.33M -6.21M -427M -6.24M -43.21M -16.72M -218M -16.93M -16.56M -695M -680K -585K -550K -502K -937K -64.47M -942K -6.52M -2.52M -32.95M -2.55M -2.5M -105M
Net Debt -0.19 -0.16 -0.15 -0.14 -0.26 -17.82 -0.26 -1.8 -0.7 -9.11 -0.71 -0.69 -28.99 -1.24 -1.07 -1 -0.92 -1.71 -117.56 -1.72 -11.88 -4.6 -60.09 -4.66 -4.55 -191.21
Logo Strasbaugh
Strasbaugh design and manufacturing of advanced surfacing technology for the global Semiconductor, Silicon, Data Storage, micro-electromechanical system (MEMS), ), light emitting diode (LED), Telecommunications and Precision Optics industries. The products are used by the customers in the fabrication of integrated circuits, known as chips or semiconductors, and in the fabrication of silicon wafers. The semiconductors are built on a silicon wafer base and include a range of circuit components, which are connected by multiple layers of wiring or interconnect. The Company’s products are STB P300- 300mm Production CMP and Silicon Polishing System: 2 spindel, 3 table polishing system; 6EG -300mm CMP System: 1 spindle, 1 table CMP system; 6EC- 200mm CMP System: 1 spindle, 1 table CMP system; 6DS-SP - 200mm CMP System: 2 spindles, 2 table auto-loading CMP system; 7AF, 7AF-SP & 7AA-II - 200mm & 150mm Wafer Grinders, and 6DZ - 200mm Prime Wafer Polisher.
Employees
82
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