Valuation: ChipMOS TECHNOLOGIES INC.

Market Cap 56.7B 1.75B 1.54B 1.43B 1.32B 2.47B 167B 2.51B 16.98B 6.65B 82.98B 6.57B 6.43B 287B P/E 2026 *
18.8x
P/E 2027 * 12.8x
Enterprise Value 60.13B 1.86B 1.63B 1.52B 1.4B 2.62B 177B 2.66B 18.01B 7.05B 88B 6.97B 6.82B 304B EV / Sales 2026 *
1.99x
EV / Sales 2027 * 1.78x
Free-Float
77.34%
Yield 2026 *
1.54%
Yield 2027 * 2.56%
Manager TitleAgeSince
Director of Finance/CFO 54 2017-09-30
President 67 1997-07-16
Corporate Officer/Principal 60 2007-04-16
Director TitleAgeSince
Chairman 67 1997-07-16
Director/Board Member 67 2007-06-27
Director/Board Member 64 2015-06-02
Change 5-day change 1-year change 3-year change Capi.($)
-.--%-.--% - - 1.95B
-2.90%-12.87%+120.98%+112.62% 625B
-7.96%-16.39%+173.01%+273.29% 365B
-10.96%-14.10%+100.00%+174.12% 174B
-8.88%-7.20%+260.91%+385.96% 82.52B
-14.05%-10.62%+127.60%+77.11% 23.85B
-6.59%-15.28%+29.08%+9.44% 19.27B
-10.82%-14.14%+132.00%+261.72% 18.36B
-24.58%-30.84%+117.39%+55.81% 15.05B
-9.76%-20.05%+134.76%+95.71% 13.05B
Average -9.62%-4.10%+132.86%+160.64% 148.43B
Weighted average by Cap. -6.35%-5.02%+140.12%+180.52%

Financials

2026 *2027 *
Net sales 30.22B 934M 819M 763M 702M 1.32B 89.19B 1.34B 9.05B 3.54B 44.23B 3.5B 3.43B 153B 34.72B 1.07B 941M 876M 806M 1.51B 102B 1.54B 10.4B 4.07B 50.81B 4.03B 3.94B 176B
Net income 3.05B 94.29M 82.75M 77.06M 70.87M 133M 9.01B 135M 914M 358M 4.47B 354M 346M 15.43B 4.5B 139M 122M 114M 105M 196M 13.28B 199M 1.35B 528M 6.59B 522M 511M 22.76B
Net Debt 3.44B 106M 93.13M 86.73M 79.77M 150M 10.14B 152M 1.03B 403M 5.03B 398M 390M 17.37B 5.24B 162M 142M 132M 122M 228M 15.47B 232M 1.57B 614M 7.67B 608M 595M 26.51B
Logo ChipMOS TECHNOLOGIES INC.
ChipMOS Technologies Inc is a Taiwan-based company mainly engaged in the integrated circuits (IC) packaging and testing business. The company's major products and services include multi-chip packaging, thin small-outline packages (TSOP), ball grid array (BGA) packaging and chip on film (COF) packaging services, as well as wafer bumping, wafer-level chip-size packaging, and wafer-overpackaging technologies. The Company's packaged and tested products are mainly used in automotive, information, communication, mobile phone, wearable and consumer electronics related products. The Company also provides customers with full-stage processing and distribution services. The Company mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.
Employees
5,688
Trader
Investor
-
Global
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Quality
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ESG MSCI
A