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Manager TitleAgeSince
Chief Executive Officer - 2022-08-01
Director of Finance/CFO - 2022-09-11
Chief Tech/Sci/R&D Officer - -
Director TitleAgeSince
Chairman 65 2021-09-27
Director/Board Member 68 2018-10-17
Director/Board Member - 2022-08-01
Change 5-day change 1-year change 3-year change Capi.($)
-11.54%-4.17% - - 9.5M
+4.35%+18.77%+235.84%+326.78% 451B
+4.77%+14.12%+130.53%+196.72% 72.07B
+5.89%+16.85%+100.15%+160.95% 56.03B
+2.64%+17.03%+142.26%+261.32% 55.13B
+0.90%+7.15%+114.47%+29.11% 43.83B
+10.03%+23.14%+202.01%+207.82% 44.22B
+3.75%+8.01%+144.17%+212.73% 27.46B
+12.84%+23.95%+420.43%+278.71% 27.3B
+20.00%+36.89%+240.85%+197.60% 21.47B
Average +5.13%+12.76%+192.30%+207.97% 88.74B
Weighted average by Cap. +4.10%+12.98%+205.12%+266.93%
Logo REVASUM
Revasum, Inc. designs, manufactures, and markets a portfolio of semiconductor processing equipment (also known as systems). The systems that the Company manufactures are an integral part of the production chain in manufacturing and processing wafers sized 200mm and below. These wafers are used to make microchips, sensors, light-emitting diode (LED)s, radiofrequency (RF) devices and power devices, used in connected Internet of things (IoT) devices, mobile phones, wearables, automotive, 5G and industrial applications. Its product portfolio includes grinding, polishing and chemical-mechanical planarization (CMP) equipment used to manufacture substrates and devices for the global semiconductor industry. Its equipment solutions include 6EZ Polisher, 7AF-HMG Grinder, and Re-Manufactured Equipment. 6EZ Polisher is an automated, single wafer, dry-in-dry-out polisher designed specifically for silicon carbide (SiC). The Company operates in United States, China, Europe, Japan, Korea and Taiwan.
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