Valuation : Tera Probe, Inc.

Market Cap 96.43B 625M 538M 506M 462M 861M 59.29B 866M 5.99B 2.32B 30.3B 2.35B 2.3B P/E 2026 *
15.3x
P/E 2027 * 11.5x
Enterprise Value 96.43B 625M 538M 506M 462M 861M 59.29B 866M 5.99B 2.32B 30.3B 2.35B 2.3B EV / Sales 2026 *
1.56x
EV / Sales 2027 * 1.21x
Free-Float
36.64%
Yield 2026 *
1.89%
Yield 2027 * 2.64%
1 day+5.66%
1 week+4.48%
Current month-1.15%
1 month-3.86%
3 months+18.02%
6 months+35.92%
Current year+77.78%
1 week 10,400
Extreme 10400
11,660
1 month 9,620
Extreme 9620
13,090
Current year 6,290
Extreme 6290
14,960
1 year 4,605
Extreme 4605
14,960
3 years 1,901
Extreme 1901
14,960
5 years 1,175
Extreme 1175
14,960
10 years 404
Extreme 404
14,960
Manager TitleAgeSince
Director of Finance/CFO 51 2020-02-29
President 59 2020-03-25
Chief Tech/Sci/R&D Officer 56 2020-02-29
Director TitleAgeSince
Director/Board Member 59 2005-08-31
Director/Board Member 55 2013-05-31
Director/Board Member 75 2005-08-31
Change 5-day change 1-year change 3-year change Capi.($)
+5.85%+4.48%+140.60%+156.29% 671M
+1.82%+10.59%+107.90%+279.68% 242B
-1.36%+2.77%+163.10%+691.01% 162B
+4.21%+10.91%+212.92%+273.18% 55.82B
+6.17%+18.74%+285.08% - 37.44B
-1.12%-5.91%+357.20%+615.13% 25.5B
-1.40%-4.99%+76.89%+186.30% 13.37B
-5.20%-7.39%+214.04%+273.51% 11.35B
-1.65%-3.76%+66.82%+256.87% 11.11B
+10.00%+11.43%+347.67%+1,118.35% 8.09B
Average +1.74%+3.47%+197.22%+427.82% 56.77B
Weighted average by Cap. +1.22%+6.57%+160.89%+430.33%

Financials

2026 *2027 *
Net sales 62B 402M 346M 325M 297M 554M 38.12B 557M 3.85B 1.49B 19.48B 1.51B 1.48B 80B 519M 446M 420M 383M 715M 49.18B 718M 4.97B 1.92B 25.14B 1.95B 1.91B
Net income 6.3B 40.86M 35.13M 33.05M 30.16M 56.28M 3.87B 56.57M 392M 151M 1.98B 153M 150M 8.4B 54.47M 46.84M 44.06M 40.21M 75.04M 5.16B 75.43M 522M 202M 2.64B 205M 200M
Net Debt - -
Logo Tera Probe, Inc.
Tera Probe Inc is a Japan-based company engaged in contract wafer testing and final testing within the semiconductor manufacturing process. The semiconductor manufacturing process is generally divided into the front-end process, where semiconductor chips are fabricated on wafers, and the back-end process, where semiconductor chips are assembled and packaged. The inspection performed in the front-end process is called wafer testing, and the inspection performed in the back-end process is called final testing. The Group undertakes both testing processes. Furthermore, the Company contributes to reducing customers' wafer test costs through contracted program development and probe card design, comprehensive support from device evaluation to mass production, and proposals for improving test efficiency.
Employees
1,127
Date Price Change Volume
26-09-08 JP¥11,220.00 +5.85% 30,300
26-09-08 JP¥10,600.00 -6.85% 73,400
26-09-07 JP¥11,380.00 +2.61% 97,000
26-09-04 JP¥11,090.00 +4.72% 57,000
26-09-03 JP¥10,590.00 -1.21% 56,500
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
1
Last Close Price
10,600.00
Average target price
-

Quarterly revenue - Rate of surprise

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