Valuation: Tera Probe, Inc.

Market Cap 117B 734M 634M 596M 542M 1.02B 70.19B 1.04B 6.98B 2.73B 35.15B 2.76B 2.7B P/E 2026 *
23.4x
P/E 2027 * 19.5x
Enterprise Value 117B 734M 634M 596M 542M 1.02B 70.19B 1.04B 6.98B 2.73B 35.15B 2.76B 2.7B EV / Sales 2026 *
2.05x
EV / Sales 2027 * 1.67x
Free-Float
36.64%
Yield 2026 *
1.17%
Yield 2027 * 1.36%
1 day-6.07%
1 week+3.52%
Current month+17.66%
1 month+13.99%
3 months+5.14%
6 months+28.30%
Current year+91.43%
1 week 11,450
Extreme 11450
12,840
1 month 8,320
Extreme 8320
13,280
Current year 6,290
Extreme 6290
14,960
1 year 4,120
Extreme 4120
14,960
3 years 1,901
Extreme 1901
14,960
5 years 1,175
Extreme 1175
14,960
10 years 404
Extreme 404
14,960
Manager TitleAgeSince
Director of Finance/CFO 51 2020-02-29
President 59 2020-03-25
Chief Tech/Sci/R&D Officer 56 2020-02-29
Director TitleAgeSince
Director/Board Member 59 2005-08-31
Director/Board Member 55 2013-05-31
Director/Board Member 75 2005-08-31
Change 5-day change 1-year change 3-year change Capi.($)
-5.92%+3.52%+184.10%+203.40% 734M
-2.70%+2.83%+132.84%+329.79% 266B
+2.47%+10.16%+229.32%+729.45% 168B
+1.73%+10.41%+282.74%+313.62% 65.47B
-2.66%+4.27%+314.47% - 37.06B
+0.48%-0.06%+520.18%+700.71% 26.56B
+1.19%-2.72%+119.68%+222.38% 14.17B
-1.69%-0.12%+320.50%+313.45% 12.13B
-2.56%+2.07%+87.26%+299.00% 9.91B
+0.56%0.00%+74.06%+99.78% 8.86B
Average -0.91%+1.65%+226.51%+356.84% 60.88B
Weighted average by Cap. -0.50%+4.97%+205.39%+455.15%

Financials

2026 *2027 *
Net sales 57B 358M 309M 291M 264M 497M 34.25B 505M 3.41B 1.33B 17.15B 1.34B 1.32B 70B 440M 380M 357M 325M 610M 42.06B 621M 4.18B 1.64B 21.06B 1.65B 1.62B
Net income 5B 31.42M 27.14M 25.5M 23.19M 43.6M 3B 44.32M 299M 117M 1.5B 118M 115M 6B 37.71M 32.57M 30.6M 27.83M 52.32M 3.61B 53.19M 359M 140M 1.81B 142M 138M
Net Debt - -
Logo Tera Probe, Inc.
Tera Probe Inc is a Japan-based company engaged in contract wafer testing and final testing within the semiconductor manufacturing process. The semiconductor manufacturing process is generally divided into the front-end process, where semiconductor chips are fabricated on wafers, and the back-end process, where semiconductor chips are assembled and packaged. The inspection performed in the front-end process is called wafer testing, and the inspection performed in the back-end process is called final testing. The Group undertakes both testing processes. Furthermore, the Company contributes to reducing customers' wafer test costs through contracted program development and probe card design, comprehensive support from device evaluation to mass production, and proposals for improving test efficiency.
Employees
1,127
Date Price Change Volume
26-08-17 JP¥12,080.00 -5.92% 301,700
26-08-14 JP¥12,840.00 +7.00% 296,000
26-08-13 JP¥12,000.00 +1.95% 204,800
26-08-12 JP¥11,770.00 +1.03% 123,600
26-08-10 JP¥11,650.00 +0.43% 65,800
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
1
Last Close Price
12,840.00
Average target price
-

Quarterly revenue - Rate of surprise

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