Valuation: Tera Probe, Inc.

Market Cap 126B 783M 684M 629M 586M 1.11B 74.54B 1.13B 7.55B 2.94B 36.64B 2.94B 2.88B P/E 2026 *
25.3x
P/E 2027 * 21x
Enterprise Value 126B 783M 684M 629M 586M 1.11B 74.54B 1.13B 7.55B 2.94B 36.64B 2.94B 2.88B EV / Sales 2026 *
2.22x
EV / Sales 2027 * 1.8x
Free-Float
36.64%
Yield 2026 *
1.08%
Yield 2027 * 1.26%
1 day+5.07%
1 week+5.07%
Current month+3.27%
1 month+30.82%
3 months+70.10%
6 months+120.32%
Current year+120.32%
1 week 12,290
Extreme 12290
14,370
1 month 8,510
Extreme 8510
14,960
Current year 6,290
Extreme 6290
14,960
1 year 3,125
Extreme 3125
14,960
3 years 1,901
Extreme 1901
14,960
5 years 1,175
Extreme 1175
14,960
10 years 404
Extreme 404
14,960
Manager TitleAgeSince
Director of Finance/CFO 51 2020-02-29
President 59 2020-03-25
Chief Tech/Sci/R&D Officer 55 2020-02-29
Director TitleAgeSince
Director/Board Member 59 2005-08-31
Director/Board Member 55 2013-05-31
Director/Board Member 75 2005-08-31
Change 5-day change 1-year change 3-year change Capi.($)
+5.07%+5.07%+324.46%+238.95% 783M
-11.51%-5.26%+154.76%+385.85% 308B
+1.84%-9.54%+174.89%+475.25% 132B
-13.63%-15.51%+296.62%+230.93% 57.78B
-2.35%+5.62%+444.84% - 38.64B
+0.41%-3.87%+575.84%+541.33% 28.22B
-3.81%-9.50%+158.27%+182.85% 14.49B
+3.11%-1.09%+393.26%+344.42% 13.7B
-3.60%+8.77%+213.08%+446.49% 12.82B
+6.34%+20.88%+658.62%+990.31% 11.16B
Average -1.81%-2.96%+339.47%+426.27% 61.72B
Weighted average by Cap. -6.72%-8.49%+225.68%+405.09%

Financials

2026 *2027 *
Net sales 57B 353M 309M 284M 265M 502M 33.65B 510M 3.41B 1.33B 16.54B 1.33B 1.3B 70B 434M 379M 349M 325M 616M 41.33B 626M 4.19B 1.63B 20.31B 1.63B 1.59B
Net income 5B 31M 27.1M 24.91M 23.22M 44.03M 2.95B 44.7M 299M 116M 1.45B 116M 114M 6B 37.2M 32.52M 29.89M 27.86M 52.84M 3.54B 53.64M 359M 139M 1.74B 140M 137M
Net Debt - -
Logo Tera Probe, Inc.
Tera Probe Inc is a Japan-based company engaged in contract wafer testing and final testing within the semiconductor manufacturing process. The semiconductor manufacturing process is generally divided into the front-end process, where semiconductor chips are fabricated on wafers, and the back-end process, where semiconductor chips are assembled and packaged. The inspection performed in the front-end process is called wafer testing, and the inspection performed in the back-end process is called final testing. The Group undertakes both testing processes. Furthermore, the Company contributes to reducing customers' wafer test costs through contracted program development and probe card design, comprehensive support from device evaluation to mass production, and proposals for improving test efficiency.
Employees
1,127
Date Price Change Volume
26-07-03 JP¥13,880.00 +5.07% 139,500
26-07-02 JP¥13,210.00 -7.62% 204,600
26-07-01 JP¥14,300.00 +6.40% 144,000
26-06-30 JP¥13,440.00 +4.67% 166,400
26-06-29 JP¥12,840.00 -2.80% 151,700
Sell
Consensus
Buy
Mean consensus
BUY
Number of Analysts
1
Last Close Price
13,880.00
Average target price
-

Quarterly revenue - Rate of surprise

  1. Stock Market
  2. Stocks
  3. 6627 Stock