May 2026
Nova Snapshot
Metrology and Process Control Unique Solutions for Semiconductor Manufacturing
Nova Ltd. Nasdaq (NVMI) Novami.com
Outperforming WFE by
Resilient business model
Differentiated Portfolio
Diverse Revenue Streams
Global Footprint
$881M
+31% YoY
2025 Revenue
$1.6B
Cash Reserves
as of Dec. 31, 2025
>7300
Active Systems
$8.62
+29% YoY
2025 EPS
$218M
Free Cash Flow
>400
Customer Sites
Nova Products vs. WFE,
2020-2025 CAGR
WFE Nova
3
© Nova confidential & proprietary information
Source: Company Non-GAAP Financials data.
All Data as reported for fiscal year 2025, EPS per diluted share
Source: 5Y CAGR 2020-2025, Nova product revenue WFE: Gartner, 2025
Quarterly Snapshot: Q1 2026
Revenue
+10%
YoY
EPS
+7%
YoY
$213M
$2.18
$235M
$2.33
Highlights
Record revenues from memory devices, driven by demand for advanced DRAM and HBM
Record sales of Nova Metrion, driven by advanced nodes in both memory and logic
Q1 2025 Q1 2026
Company Guidance Revenue EPS
$2.10- $2.24 (GAAP)
Q2 2026 $245 -$255M
$2.34-$2.48 (non-GAAP)
Record sales of Nova AncoScene front-end chemical metrology solution, driven by market share growth and new customer penetrations
4
© Nova confidential & proprietary information
Non-GAAP Financials, Q1 2026
A Market Leap
Nova Benefits from AI Demand in Multiple Segments
13%
>$1T
Semiconductor Industry Revenue, B$
End Markets
30%
Market Segments
Advanced
CAGR
471
831
1548
Data Center & Networking
10%
Consumer
11%
Industrial
Logic GAA
HBM
Silicon Photonics
DRAM
52%
50%
35%
21%
2023
Automotive
13%
Advanced Packaging
2.5D/3D
18%
2020
2025
2030
2025-2030 CAGR
2024-2029 CAGR*
5
© Nova confidential & proprietary information
Source: Gartner, Tech Insights, averaged forecast May 2026, 10Y CAGR 2020-2025
Sources: Gartner, Tech Insights, Yole Research, IDC, McKinsey 2025; Si Photonics CAGR 2024-2030
Manufacturing Challenges Rise in Every Segment
Memory
3D NAND
Bonding interface
DRAM
AI Processor
HBM
Silicon Photonics
Increasing Complexity
2020 vs. 2025
Advanced Logic (AI-Enabled)
Wordline steps
Storage
Local Memory
AI Data center
Logic (GPU/CPU)
FinFET
CPU
227B
Advanced Packaging
X9
Transistors
HBM
Advanced packaging
CoWoS (2.5D)
3D-SOC
<10µm
NAND
43XL
X30
I/O Pitch
X4
Layers
16L
DRAM
16GB
X2.5
Stacked chips
X2
Memory Cells
6
© Nova confidential & proprietary information
Source: Gartner, Tech Insights, Yole, public manufacturer reports 2020-2025
Market Demand Drives Multiple Technology Inflection Points
AI needs Better Performance
Power Efficiency
Density
Logic
GAA + BPD CFET
DRAM
4F2 DRAM 3D DRAM
3D NAND
Growing Complexity
Complex, scaled 3D structures
Packaging complexity
New materials and chemistries
New connectivity: Silicon Photonics
Higher Process Control
Cost
Multi Stack
Advanced Packaging
Controller Processor
Multi Deck (HB)
Intensity
More process steps
Tighter process windows
3D
Wafer edge criticality
2.5D Interposer
Silicon Interposer
7
© Nova confidential & proprietary information
Nova Process Insight: Revealing the Invisible
Measure with precision, manufacture with confidence
Optical X-Ray Chemical Analysis =<2nm Node | Dimensional Materials Chemical 300, 200, 150 mm Wafers | AI-Powered Software Suite Physical modeling & Algorithms | ||
8
© Nova confidential & proprietary information
Logic
FinFET GAA BPSD
Packaging & Other
2.5D Interposer 3D
HBM
Silicon Photonics
Memory
3D NAND
Advanced DRAM 3D DRAM
Metrology Portfolio Targeted at Key Challenges
Logic
Memory
Packaging
Dimensional
Materials
Chemical
Nanosheets individual thickness
HAR TSVs
MOL structure complexity
Wafer edge metrology
Si, SiGe stress and strain
Multi-work function layers
New material characterization
Increasing vias volume & aspect ratio
9
More plating steps, tighter process control
HAR profiles & CD's
Hybrid bonding, Cu recess control
Warpage
3D DRAM profiling
Si, SiGe stress and strain
Composition & thickness
Doping & contamination
Increasing vias volume & aspect ratio
Tighter contamination control
TSV & RDL
Panel-level & frame handling
Warpage & thinner dies
Topography
Pre & Post- hybrid bonding
uBump metal oxidation control
Hybrid bonding surface characterization
More Plating steps
Bonding & connection materials
proprietary information
Contaminants & photoresist leach detection
© Nova confidential &
Leveraging Technology Differentiation
Measuring Critical Applications Across the Industry
Dimensional Optical CD
Materials
Chemical
Integrated
VeloCD/ Standalone
Prism
WMC
VeraFlex® (XPS+SRF)
Elipson® (Inline Raman)
Metrion® (Inline SIMS)
AncoScene® Front-End
Ancolyzer® Wafer level packaging
DMR®
Direct Metal Replenishment
Adv. Logic
Adv. Memory
Adv. Packaging
Specialty Devices
10
© Nova confidential & proprietary information
150. 200, 300mm wafers
Already measuring related applications in fabs
Advanced packaging includes hybrid bonding and HBM processes; Specialty Devices - sensors, power, analog
Holistic AI-Powered Software Solutions
Intelligent software layer, delivering continuous insights and optimization, increasing Nova systems asset value
Productivity
Predictive and Preventive Maintenance, trouble shooting and utilization improvements
Manage large fleets, boosting efficiency, and high scale metrology control
Modeling
Physics, AI & advanced algorithms applied to model the most advanced structures
Machine learning leveraged to reduce time to solution and increase throughput
11
© Nova confidential &
proprietary information
Elements of Product Strategy
Product strategy
Organic &
Maintain Tech Leadership
of Annual Revenue invested in R&D
Materials
Leadership
New Growth Engines
Early Access
Lab to Fab Technology
Path Finding and Incubation
Adjacent
Process Control Markets
12
© Nova confidential & proprietary information
Company non-GAAP financial data, gross investment
Financial Target Model
Operating Margin Earnings
28%-33% ~10$
$1000M
M&A
Revenue
+$1B
Gross Margin
57%-60%
R&D Investment
15%-17%
SG&A
12%-14%
Tax
15%
Share Count
32M
$800M
$600M
$400M
2019 2024 Target
13
© Nova confidential & proprietary information
Non-GAAP Financials
Global Strength, Ready for Secular Growth
4 R&D and Production Centers, 31 sites
Europe
USA Germany
Korea
California 8 sites
5 Sites
China
4 Sites
Japan
2 Sites
Israel
2 Sites
Taiwan
Legend:
R&D and Production Field site: Sales & Service
Rehovot
Corporate sites
Singapore
1 Site
5 Sites
14
© Nova confidential & proprietary information
Source: Company data,: office, lab, warehouse and cleanroom
Sustainability
To become an active influencer in creating a more sustainable and equitable future
Integrity &
Transparency
Governance
People First Always
Social
Scope 1+2 Foundation
Established
Environment
15
proprietary information
Read the 2025 Sustainability Impact Review
© Nova confidential &
Key Takeaways
16
End market demand and process complexity drive growth
Increasing need for advanced metrology and process control solutions
proprietary information
Positioned for Continuous Growth
Unique, disruptive technology portfolio
Strong market position across key segments, Broad portfolio addressing critical applications, Significant investment in R&D
Solid operational model
Supports clear strategy for long-term growth
© Nova confidential &
Thank You
investors@novami.com
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Nova Ltd. published this content on May 14, 2026, and is solely responsible for the information contained herein. Distributed via Public Technologies (PUBT), unedited and unaltered, on May 14, 2026 at 13:47 UTC.
