VM Inc.

Equities

A089970

KR7089970008

Semiconductor Equipment & Testing

End-of-day quote Korea S.E. Other stock markets 18:00:00 2024-05-13 EDT			5-day change	1st Jan Change
15,270 ^KRW	+0.33%		-8.45%	+8.30%

2023	Adaptive Plasma Technology Corp. Reports Earnings Results for the Full Year Ended December 31, 2022	CI
2023	Tranche Update on Adaptive Plasma Technology Corp.'s Equity Buyback Plan announced on August 5, 2022.	CI

Adaptive Plasma Technology Corp. announced that it expects to receive KRW 21.9999955 billion in funding

November 03, 2022

Adaptive Plasma Technology Corp. announced a private placement of 1,554,770 preferred shares at an issue price of KRW 14,150 for the gross proceeds of KRW 21,999,995,500 on November 4, 2022. The transaction will include participation from B&W Ace Private Equity Joint Venture Company.

The transaction has been approved by shareholders of the company. The shares are fully convertible into 1,554,770 common shares from November 15, 2023 - October 15, 2032. The shares have a holding period of 12 months.

The transaction is expected to close on November 14, 2022.

Latest news about VM Inc.

Adaptive Plasma Technology Corp. Reports Earnings Results for the Full Year Ended December 31, 2022	23-03-22	CI
Tranche Update on Adaptive Plasma Technology Corp.'s Equity Buyback Plan announced on August 5, 2022.	23-02-06	CI
Tranche Update on Adaptive Plasma Technology Corp.'s Equity Buyback Plan announced on August 5, 2022.	23-02-06	CI
Adaptive Plasma Technology Corp.'s Equity Buyback announced on August 5, 2022, has expired with 565,638 shares, representing 2.62% for KRW 9,992.7 million.	23-02-05	CI
Adaptive Plasma Technology Corp. announced that it has received KRW 21.9999955 billion in funding	22-11-13	CI
Tranche Update on Adaptive Plasma Technology Corp.'s Equity Buyback Plan announced on August 5, 2022.	22-11-07	CI
Adaptive Plasma Technology Corp. announced that it expects to receive KRW 21.9999955 billion in funding	22-11-03	CI
Adaptive Plasma Technology Corp. announces an Equity Buyback for KRW 10,000 million worth of its shares.	22-08-04	CI
Adaptive Plasma Technology Corp. authorizes a Buyback Plan.	22-08-04	CI
Adaptive Plasma Technology Corp.'s Equity Buyback Plan announced on March 30, 2021, has expired.	21-09-29	CI
Adaptive Plasma Technology Corp.(KOSDAQ:A089970) added to S&P Global BMI Index	21-09-20	CI
Adaptive Plasma Technology Corp. announces an Equity Buyback for KRW 10,000 million worth of its shares.	21-03-30	CI
Adaptive Plasma Technology Corp. authorizes a Buyback Plan.	21-03-29	CI
Tranche Update on Adaptive Plasma Technology Corp.'s Equity Buyback Plan announced on March 18, 2020.	20-09-18	CI
Tranche Update on Adaptive Plasma Technology Corp.'s Equity Buyback Plan announced on March 18, 2020.	20-09-18	CI
Adaptive Plasma Technology Corp.'s Equity Buyback announced on March 18, 2020, has expired with 525,141 shares, representing 2.47% for KRW 2,996.86 million.	20-09-17	CI
Tranche Update on Adaptive Plasma Technology Corp.'s Equity Buyback Plan announced on March 18, 2020.	20-06-18	CI
Adaptive Plasma Technology Corp. announces an Equity Buyback for KRW 3,000 million worth of its shares.	20-03-18	CI
Adaptive Plasma Technology Corp. authorizes a Buyback Plan.	20-03-17	CI
Adaptive Plasma Technology Corp.'s Equity Buyback announced on June 3, 2019, has expired.	19-12-01	CI
Adaptive Plasma Technology Corp. announces an Equity Buyback for KRW 5,000 million worth of its shares.	19-06-02	CI
Adaptive Plasma Technology Corp. authorizes a Buyback Plan.	19-06-02	CI
Adaptive Plasma Technology Corp.’s Equity Buyback announced on November 28, 2018, has expired.	19-05-26	CI
Tranche Update on Adaptive Plasma Technology Corp.'s Equity Buyback Plan announced on November 28, 2018.	19-03-04	CI
Adaptive Plasma Technology Corp. announces an Equity Buyback for KRW 5,000 million worth of its shares.	18-11-28	CI

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Company Profile

VM Inc, formerly Adaptive Plasma Technology Corp, is a Korea-based company principally engaged in the manufacture and sale of etching equipment that are used for the semiconductor manufacturing. The Companyâs product profile consists of dry etchers, light emitting diode (LED) etchers, through silicon via (TSV) etchers, plasma doping system, plasma sawing system and others. The dry etchers are inclusive of oxide etchers, polysilicon (Poly) etchers and metal etchers. The main product is 300mm poly etch system, which is comprised of load port, equipment front end module (EFEM), buffer module (BM), transfer module (TM) and process module (PM).

Sector

Semiconductor Equipment & Testing

Calendar

2024-08-08 - Q2 2024 Earnings Release (Projected)

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Sector Semiconductor Machinery Manufacturing

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Semiconductor Machinery Manufacturing