Siemens announces the signing of a memorandum of understanding with Hon Hai Technology Group (Foxconn) to accelerate the digital transformation and sustainability of smart manufacturing platforms.

This collaboration will focus in particular on global manufacturing processes in the electronics, information and communication technology, and electric vehicle sectors.

Siemens and Foxconn aim to establish a scalable engineering and manufacturing ecosystem using advanced technologies such as digital twins and artificial intelligence.

Siemens adds that the partnership will also seek to improve Foxconn's sustainability performance, reducing energy consumption and CO2 emissions.

Copyright (c) 2024 CercleFinance.com. All rights reserved.