Simmtech Holdings Co., Ltd. Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2023
November 13, 2023 at 01:53 am
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Simmtech Holdings Co., Ltd. reported earnings results for the third quarter and nine months ended September 30, 2023. For the third quarter, the company reported sales was KRW 0.00021 million compared to KRW 0.00025 million a year ago. Net loss was KRW 15,427.37 million compared to net income of KRW 27,753.98 million a year ago. Basic loss per share from continuing operations was KRW 272 compared to basic earnings per share from continuing operations of KRW 598 a year ago. Diluted loss per share from continuing operations was KRW 258 compared to diluted earnings per share from continuing operations of KRW 560 a year ago. Basic loss per share was KRW 272 compared to basic earnings per share of KRW 598 a year ago. Diluted loss per share was KRW 258 compared to diluted earnings per share of KRW 560 a year ago.
For the nine months, sales was KRW 0.00003 million compared to negative sales of KRW 0.00027 million a year ago. Net loss was KRW 70,939.08 million compared to net income of KRW 54,434.58 million a year ago. Basic loss per share from continuing operations was KRW 1,245 compared to basic earnings per share from continuing operations of KRW 1,172 a year ago. Diluted loss per share from continuing operations was KRW 1,104 compared to diluted earnings per share from continuing operations of KRW 958 a year ago. Basic loss per share was KRW 1,245 compared to basic earnings per share of KRW 1,172 a year ago. Diluted loss per share was KRW 1,104 compared to diluted earnings per share of KRW 958 a year ago.
SIMMTECH HOLDINGS Co., Ltd., formerly SIMMTECH Co., Ltd., is a Korea-based company engaged in the manufacture of printed circuit boards (PCBs). The Companyâs products mainly consist of main boards and package substrates. Its main boards include memory module PCBs, which are used for desktop personal computers (PCs), notebook PCs, servers and others; mobile phone boards, which are used for mobile phones, mobile Internet devices, navigations and others; solid state drive (SSD) module PCBs, and other multilayer PCBs, among others. Its package substrates are used for integrating semiconductor chips. It also produces build-up PCBs for telecommunication terminal devices, repeaters and Internet devices, as well as burn-in boards (BIBs) used for burn-in tests.