Dongguan Shengyi Capital Investment Co., Ltd. announced that it expects to receive CNY 80 million in funding from Shengyi Technology Co., Ltd.
December 05, 2021
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Dongguan Shengyi Capital Investment Co., Ltd. announced that it will receive CNY 80 million in an equity round of funding on December 6, 2021. The transaction includes participation from returning investor, Shengyi Technology Co., Ltd. to retain its 100% stake in the company. Of the total capital increase, CNY 40 million will be included in the registered capital and CNY 40 million will be included in the capital reserve of the company. The registered capital of the company will increase from CNY 355.7 million to CNY 395.7 million post closing of the transaction. The transaction has been approved at the eleventh meeting of the tenth board of directors and shareholders at the general meeting of the investor.
SHENGYI TECHNOLOGY CO., LTD. is a China-based company, principally engaged in the manufacture and distribution of copper clad laminates (CCLs) and bonding sheets. The Company is also engaged in the manufacture and distribution of printed circuit boards (PCBs). Its products are mainly used for making single, double-sided and multi-layer circuit boards, applied in electronics such as mobile phones, automobile electronics, communications devices and computers. It distributes its products in domestic and overseas markets.