Novoray Corporation

Novoray Corp is a China-based company mainly engaged in the research, development, manufacturing and sales of inorganic fillers and particle carrier products. The Company's products include micron-level and sub-micron-level angular powders, micron-level spherical inorganic powders processed by flame fusion method, sub-micron-level spherical particles processed by high-temperature oxidation method and liquid phase method, various ultrafine particles with surface treatment, functional particles manufactured by various methods and slurry products developed to solve particle dispersion. Its products are mainly used in epoxy molding materials (EMC), liquid molding materials (LMC) and underfill materials (Underfill) for chip packaging, copper clad laminates (CCL) for electronic circuits, laminated adhesive films, and thermal interface materials (TIM), new energy vehicle battery module thermal conductive adhesives and solar photovoltaic cell structural adhesives and other fields.