ICatch Technology, Inc. Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2023
August 11, 2023 at 03:33 am
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iCatch Technology, Inc. reported earnings results for the second quarter and six months ended June 30, 2023. For the second quarter, the company reported sales was TWD 286.29 million compared to TWD 354.59 million a year ago. Net income was TWD 4.35 million compared to TWD 45.48 million a year ago. Basic earnings per share from continuing operations was TWD 0.05 compared to TWD 0.53 a year ago. Diluted earnings per share from continuing operations was TWD 0.05 compared to TWD 0.53 a year ago.
For the six months, sales was TWD 529.66 million compared to TWD 617.32 million a year ago. Net loss was TWD 31.14 million compared to net income of TWD 58.51 million a year ago. Basic loss per share from continuing operations was TWD 0.33 compared to basic earnings per share from continuing operations of TWD 0.69 a year ago. Diluted loss per share from continuing operations was TWD 0.33 compared to diluted earnings per share from continuing operations of TWD 0.68 a year ago.
iCatch Technology, Inc. is a Taiwan-based company mainly engaged in the provision of digital camera image and video processing chips. The Company mainly provides low-end image and video processing chips for low-end digital cameras, hunting trail cameras, simple automobile data recorders; middle-end image and video processing chips for medium and high-end digital cameras, sports cameras, network cameras and main automobile data recorders; high-end image and video processing chips for high-end digital cameras, 4K motion cameras, 360 virtual reality (VR) cameras, multi-channel splicing network cameras and high-end automobile data recorders, as well as other products, including mobile phone camera module image sensor processors (ISP) chips, used to improve mobile phone image quality, and low voltage differential signaling (LVDS) analog wired transmission and reception interface chips to connect remote photographic lens modules and center processing prime wafers.