Xiamen Silan Ming Gallium Compound Semiconductor Co., Ltd. announced that it expects to receive CNY 170.37 million in funding from Hangzhou Silan Microelectronics Co., Ltd, Xiamen Semiconductor Investment Group Co., Ltd.
November 07, 2019
Share
Xiamen Silan Ming Gallium Compound Semiconductor Co., Ltd. announced that it will receive CNY 170,370,000 in funding on November 8, 2019. The transaction includes participation from existing investors Xiamen Semiconductor Investment Group Co., Ltd. which will continue to hold 70% stake by investing CNY 119,259,000 and Hangzhou Silan Microelectronics Co., Ltd (SHSE:600460) which will continue to hold 30% stake by investing CNY 51,111,000. After the capital increase, registered capital of the company will grow from CNY 800,000,000 to CNY 970,370,000. The transactions were approved by the 5th meeting of the 7th directorate of Hangzhou Silan Microelectronics Co., Ltd.
Hangzhou Silan Microelectronics Co., Ltd. is a China-based company principally engaged in the design, manufacture and sales of electronic components. The Company is also engaged in the importing and exporting of mechanical and electrical products. The Company's main products include integrated circuits, semiconductor discrete devices and light-emitting diode (LED) products. The Company mainly operates its businesses in Zhejiang Province, China.
Xiamen Silan Ming Gallium Compound Semiconductor Co., Ltd. announced that it expects to receive CNY 170.37 million in funding from Hangzhou Silan Microelectronics Co., Ltd, Xiamen Semiconductor Investment Group Co., Ltd.