Fujikura Ltd. has developed a high performance heat pipe for data center cooling application. Newly developed heat pipe has doubled the maximum heat transfer capacity compared with conventional products. In data centers, server CPUs are becoming more powerful as 5G and AI become more widespread, leading to faster communications.

The more powerful a CPU, the more heat it generates, and the more cooling it needs to perform up to its full potential. To address this cooling issue, a high-performance liquid cooling system works well, but such system requires very high infrastructure cost. To avoid the high cost, there is a trend of extending the usage of inexpensive but high performance air cooling solutions.

High performance heat pipe is required for the air cooling systems. A heat pipe is an evacuated and sealed container charged with a small quantity of working fluid. Without the assistance of any external force, a heat pipe can transfer heat from one end to other by the repeated action of vaporization and condensation. New wick structure is developed to enhance the performance of traditional heat pipe.

Maximum heat transfer capacity of the new heat pipe (original diameter 8mm and flattening thickness 4mm) reached to 100[W] compared to that of the conventional types 55.