Digital Realty announced the availability of liquid-to-chip cooling technology, the next evolution in high-density deployment support. This innovative advancement represents a significant leap forward in addressing the evolving challenges of managing high-density workloads, particularly in the realm of artificial intelligence (AI) and data-intensive applications. The new offering from Digital Realty, which builds upon the company's standardized high-density colocation offering, introduces direct liquid cooling (DLC), bringing liquid directly to customers' infrastructure, allowing for greater relevance and versatility in meeting emerging AI demand.

This approach enables businesses to deploy high-density configurations within a shared environment, in close proximity to the cloud, as well as network and AI service providers, while accommodating the distinct needs of individual setups, providing additional flexibility to customers. Furthermore, Digital Realty's recently announced Private AI Exchange (AIPx) allows for new data exchange options in support of these DLC-enabled solutions. Key highlights of Digital Realty's advanced high-density deployment support include the ability to leverage a wide range of mechanical solutions, such as rear door heat exchangers (RDHx) and DLC, enabling the efficient management of power densities ranging from 30 to 150 kilowatts per rack, and beyond.

The combination of RDHx with DLC effectively doubles the power densities that can be supported, empowering businesses to tackle the escalating demands of modern IT infrastructure and accelerate the adoption of AI by enterprises, through private, cloud and hybrid solutions. Digital Realty's solution is designed to be both flexible and accessible. Deployment options are available in more than half of Digital Realty's data centers worldwide, with plans to expand support to additional sites and to leverage existing infrastructure to meet emerging AI requirements.