China Chippacking Technology Co.,Ltd. announced that it expects to receive CNY 130 million in funding
May 10, 2023
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China Chippacking Technology Co.,Ltd. announced a private placement on May 11, 2023. The Company held the 2022 Annual General Shareholders Meeting, and authorized the Company’s Directorate to implement a simplified private placement of shares.
On June 20, 2023, The company announced a private placement to issue A shares for gross proceeds of not more than CNY 130 million. The issue price will not less than 80% of the average price in the 20 trading days before the pricing reference date of the transaction. The transaction included the participation from not more than 35 investors. The shares cannot be transferred within 6 months from the issuance of closing date. The issue of share is not more than 30% of total share capital.
On same date, The transaction has been approved on 9th Meeting of the 4th Directorate, and 7th meeting of the 4th supervisory board. The transaction still needs to be approved from Shanghai Stock Exchange and the China Securities Regulatory Commission.
China Chippacking Technology Co Ltd is a China-based company mainly engaged in the packaging and testing of integrated circuits. Based on the development and application of integrated circuit packaging and testing technology, the Company is engaged in integrated circuit packaging, testing and providing packaging technology solutions. The Company's main packaging technology products include seven series, including Qipai, CPC, Small Outline Package (SOP), Small Outline Transistor (SOT), Low-profile Quad Flat Package (LQFP), Quad Flat No-lead Package (QFN/DFN), and Dual in line-pin package (DIP). The Company mainly conducts business within the domestic market.
CHINA CHIPPACKING TECHNOLOGY CO.,LTD. 
