CHINA CHIPPACKING TECHNOLOGY CO.,LTD. China Chippacking Technology Co.,Ltd. Stock
Equities
688216
CNE100005113
Semiconductor Equipment & Testing
|
End-of-day quote
Other stock markets
|
5-day change | 1st Jan Change | ||
| 15.73 CNY | +0.51% |
|
-7.47% | -43.15% |
Days
Hours
Minutes
Seconds
-40%
on all our subscriptions*
Last Hours!
Take advantage of the offer
* See conditions on site
| Sales 2024 * | 713M 98.82M 134M | Sales 2025 * | 856M 119M 161M | Capitalization | 1.67B 231M 315M |
|---|---|---|---|---|---|
| Net income 2024 * | 22M 3.05M 4.15M | Net income 2025 * | 60M 8.31M 11.31M | EV / Sales 2024 * | 2.34 x |
| Net cash position 2024 * | - 0 0 | Net cash position 2025 * | - 0 0 | EV / Sales 2025 * | 1.95 x |
| P/E ratio 2024 * |
74.9
x | P/E ratio 2025 * |
27.6
x | Employees | 1,806 |
| Yield 2024 * |
-
| Yield 2025 * |
-
| Free-Float | 30.88% |
More Fundamentals
* Assessed data
More news
| 1 day | +0.51% | ||
| 1 week | -7.47% | ||
| Current month | -5.53% | ||
| 1 month | -0.44% | ||
| 3 months | +9.24% | ||
| 6 months | -48.05% | ||
| Current year | -43.15% |
1 week
15.10
16.92
1 month
12.3817.25
Current year
11.0327.90
1 year
11.0331.50
3 years
11.0380.80
5 years
11.0380.80
10 years
11.0380.80
| Managers | Title | Age | Since |
|---|---|---|---|
Da Zhong Liang
CEO | Chief Executive Officer | 65 | 06-10-31 |
Ze Wei Li
DFI | Director of Finance/CFO | 45 | 20-01-31 |
Shao Lin Sun
CHM | Chairman | 39 | - |
| Members of the board | Title | Age | Since |
|---|---|---|---|
Da Yue Deng
BRD | Director/Board Member | 56 | 18-09-03 |
Da Zhong Liang
CEO | Chief Executive Officer | 65 | 06-10-31 |
Ying Bai
BRD | Director/Board Member | 60 | 06-10-31 |
| Date | Price | Change | Volume |
|---|---|---|---|
| 24-05-14 | 15.73 | +0.51% | 560 019 |
| 24-05-14 | 15.65 | +3.10% | 909,164 |
| 24-05-13 | 15.18 | -4.41% | 809,542 |
| 24-05-10 | 15.88 | -4.11% | 587,169 |
| 24-05-09 | 16.56 | +0.85% | 637,755 |
End-of-day quote Shanghai S.E., May 14, 2024
More quotes
China Chippacking Technology Co Ltd is a China-based company mainly engaged in the packaging and testing of integrated circuits. Based on the development and application of integrated circuit packaging and testing technology, the Company is engaged in integrated circuit packaging, testing and providing packaging technology solutions. The Company's main packaging technology products include seven series, including Qipai, CPC, Small Outline Package (SOP), Small Outline Transistor (SOT), Low-profile Quad Flat Package (LQFP), Quad Flat No-lead Package (QFN/DFN), and Dual in line-pin package (DIP). The Company mainly conducts business within the domestic market.
Calendar
2024-08-19
- Q2 2024 Earnings Release (Projected)
Trading Rating
Investor Rating
ESG Refinitiv
Sell
Buy
Mean consensus
OUTPERFORM
Number of Analysts
1
Last Close Price
15.73
Average target price
-
EPS Revisions
Annual profits - Rate of surprise
| 1st Jan change | Capi. | |
|---|---|---|
| -43.15% | 230M | |
| +33.56% | 174B | |
| +53.95% | 36B | |
| +35.93% | 33.06B | |
| -10.45% | 30.11B | |
| +18.05% | 21.38B | |
| -15.47% | 11.25B | |
| +129.82% | 10.03B | |
| +22.35% | 5.76B | |
| -27.15% | 4.68B |
- Stock Market
- Equities
- 688216 Stock