Amlex Holdings

Equities

AMLEX

MYL03011O003

Electrical Components & Equipment

End-of-day quote BURSA MALAYSIA Other stock markets 18:00:00 2024-05-23 EDT			5-day change	1st Jan Change
0.4 ^MYR	-.--%		-.--%	-6.98%

05-07	Malaysian Shares Extend Gains on Positive Cues; Proton's Vehicle Sales Rise 17% in April	MT
04-25	Malaysian Shares Snap Six-Session Winning Streak; Amlex's Shares Plummet 42%	MT

Amlex Holdings Berhad Proposes an Interim Single Tier Dividend for the Financial Year Ending 31 March 2022, Payable on August 30, 2021

August 02, 2021 at 09:22 am

Amlex Holdings Berhad announced that the board of directors has proposed an interim single tier dividend of MYR 0.002 per ordinary share in respect of the financial year ending 31 March 2022. Ex-date is August 17, 2021. Entitlement date is August 18, 2021. Payment date is August 30, 2021.

Latest news about Amlex Holdings

Malaysian Shares Extend Gains on Positive Cues; Proton's Vehicle Sales Rise 17% in April	05-07	MT
Malaysian Shares Snap Six-Session Winning Streak; Amlex's Shares Plummet 42%	04-25	MT
Amlex Holdings Berhad Reports Earnings Results for the Half Year Ended September 30, 2023	11-30	CI
Amlex Holdings Berhad Reports Earnings Results for the Full Year Ended March 31, 2023	23-05-30	CI
Amlex Holdings Berhad Reports Earnings Results for the Full Year Ended March 31, 2023	23-05-30	CI
Amlex Holdings Berhad Reports Earnings Results for the Half Year Ended September 30, 2022	22-11-25	CI
Amlex Holdings Berhad Announces Single Tier Final Dividend for the Financial Year Ended 31 March 2022, Payable on 21 October 2022	22-10-03	CI
120,650,900 Ordinary Shares of Amlex Holdings Berhad are subject to a Lock-Up Agreement Ending on 25-SEP-2022.	22-09-24	CI
Amlex Unit to Buy Leasehold Land in Malaysia for Over $1 Million	22-08-24	MT
Amlex Holdings Berhad Reports Earnings Results for the Full Year Ended March 31, 2022	22-05-27	CI
Amlex Holdings Berhad Reports Earnings Results for the Half Year Ended September 30, 2021	21-11-25	CI
Amlex Holdings Berhad Announces Change of Address	21-11-01	CI
Amlex Holdings Berhad Announces Appointment of Lee Peng Loon as Company Secretary	21-11-01	CI
Amlex Holdings Berhad Announces Resignation of Lim Yong Chiat as Company Secretary	21-11-01	CI
Amlex Holdings Berhad Announces Appointment of P'ng Chiew Keem as Company Secretary	21-11-01	CI
Amlex Holdings Berhad Reports Audited Group and Company Earnings Results for the Financial Year Ended 31 March 2021	21-08-26	CI
Amlex Holdings Berhad Proposes an Interim Single Tier Dividend for the Financial Year Ending 31 March 2022, Payable on August 30, 2021	21-08-02	CI
Amlex Holdings Berhad Announces Appointment of Ooi Toon Kit as Independent and Non Executive Director	21-08-02	CI
Amlex Holdings Berhad Announces Unaudited Consolidated Earnings Results for the Half Year and Full Year Ended March 31, 2021	21-05-25	CI
Amlex Holdings Berhad Reports Unaudited Consolidated Earnings Results for the Six Months Ended September 30, 2020	20-11-24	CI
Amlex Holdings Berhad Announces Audited Group and Company Earnings Results for the Full Year Ended March 31, 2020	20-08-27	CI
Amlex Holdings Berhad Announces Unaudited Consolidated Earnings Results for the Half Year and Full Year Ended March 31, 2020	20-06-26	CI
Amlex Holdings Berhad Unable to Estimate Earnings Guidance for the Financial Year Ending 31 March 2021	20-06-26	CI
Amlex Holdings Berhad Reports Unaudited Consolidated Financial Results for the First Quarter Ended Sep. 30, 2019	19-11-25	CI
13,772,100 Ordinary Shares of Amlex Holdings Berhad are subject to a Lock-Up Agreement Ending on 25-SEP-2019.	19-09-24	CI

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Company Profile

Amlex Holdings Berhad is a holding company, which is engaged in the business of electro-plating, assembly of semiconductor and electronic products. The Company operates through three geographical segments: Malaysia, Philippines, and Thailand. It provides prototype product design, high precision stamping, surface finishing, and high precision molding services for the electronics components. It engages in electroplating, and assembly of semiconductor and electronic products businesses, manufactures and sells molded lead frames for interconnect and optoelectronics industries. It offers complete barrel plating services for gold, silver, palladium, nickel, tin, and copper. It stamps various types of products ranging from metal cans, piece parts to high precision lead frames and interconnectors. Its stamping presses range from about 25 tons to 90 tons. It serves semiconductor, imaging, and navigation, automotive, medical, industrial, aerospace, and consumer electronics/lighting industries.

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Electrical Components & Equipment

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Sector Electrical Component

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Electrical Component