Sang-Yun Lee

BeSang, Inc. specializes in the design, development, and delivery of 3-dimensional (3D) integrated circuit (IC) solutions. Its 3D IC technologies enable stacking multiple device layers in a vertical direction and provides solutions to CPU, DSP, ASIC, FPGA, SoC, DRAM, SRMA, flash, image sensor, and solid state drive applications. The company was founded by Sang-Yun Lee on June 23, 2003 and is headquartered in Beaverton, OR.

BeSang, Inc. specializes in the design, development, and delivery of 3-dimensional (3D) integrated circuit (IC) solutions. Its 3D IC technologies enable stacking multiple device layers in a vertical direction and provides solutions to CPU, DSP, ASIC, FPGA, SoC, DRAM, SRMA, flash, image sensor, and solid state drive applications. The company was founded by Sang-Yun Lee on June 23, 2003 and is headquartered in Beaverton, OR.

BeSang, Inc. specializes in the design, development, and delivery of 3-dimensional (3D) integrated circuit (IC) solutions. Its 3D IC technologies enable stacking multiple device layers in a vertical direction and provides solutions to CPU, DSP, ASIC, FPGA, SoC, DRAM, SRMA, flash, image sensor, and solid state drive applications. The company was founded by Sang-Yun Lee on June 23, 2003 and is headquartered in Beaverton, OR.

BeSang, Inc. specializes in the design, development, and delivery of 3-dimensional (3D) integrated circuit (IC) solutions. Its 3D IC technologies enable stacking multiple device layers in a vertical direction and provides solutions to CPU, DSP, ASIC, FPGA, SoC, DRAM, SRMA, flash, image sensor, and solid state drive applications. The company was founded by Sang-Yun Lee on June 23, 2003 and is headquartered in Beaverton, OR.