WINPAC Inc.

A097800

KR7097800007

Semiconductors

End-of-day quote Korea S.E. Other stock markets 18:00:00 2024-05-12 EDT			5-day change	1st Jan Change
1,161 ^KRW	+0.78%		+1.22%	-27.48%

04-12	WINPAC Inc. announced that it expects to receive KRW 18.564682948 billion in funding	CI
2023	WINPAC Inc. announced that it has received KRW 12 billion in funding	CI

WINPAC Inc. announced that it expects to receive KRW 18.564682948 billion in funding

April 11, 2024

WINPAC Inc. announced a private placement to issue 21,024,556 shares at an issue price of KRW 883 for the gross proceeds of KRW 18,564,682,948 on April 12, 2024. The transaction has been approved by the shareholders of the company and is expected to close on May 31, 2024.

Latest news about WINPAC Inc.

WINPAC Inc. announced that it expects to receive KRW 18.564682948 billion in funding	04-11	CI
WINPAC Inc. announced that it has received KRW 12 billion in funding	23-08-01	CI
WINPAC Inc. announced that it expects to receive KRW 12 billion in funding	23-07-30	CI
WINPAC Inc. Reports Earnings Results for the First Quarter Ended March 31, 2023	23-05-15	CI
WINPAC Inc. announced that it has received KRW 11.99999955 billion in funding	22-10-16	CI
WINPAC Inc. announced that it expects to receive KRW 11.99999955 billion in funding	22-10-06	CI
ABOV Semiconductor Co., Ltd. completed the acquisition of14.34% stake in WINPAC Inc. from TLi Inc., Sensona Inc. and Dal-Soo Kim.	21-12-21	CI
WINPAC Inc. announced that it has received KRW 14.99999832 billion in funding from ABOV Semiconductor Co., Ltd.	21-11-16	CI
ABOV Semiconductor Co., Ltd. agreed to acquire 14.34% stake in WINPAC Inc. from TLi Inc., Sensona Inc. and Dal-Soo Kim for KRW 24 billion.	21-11-08	CI
WINPAC Inc. announced that it expects to receive KRW 14.99999832 billion in funding from ABOV Semiconductor Co., Ltd.	21-11-08	CI
WINPAC Inc. announced that it has received KRW 5 billion in funding	21-06-10	CI
WINPAC Inc. announced that it expects to receive KRW 5 billion in funding	21-06-08	CI
WINPAC Inc. announced that it expects to receive KRW 999.999 million in funding	19-08-13	CI
WINPAC Inc. announced that it has received KRW 6 billion in funding from Shinhan Investment Corp., Investment Arm and other investors	19-04-04	CI
WINPAC Inc. announced that it expects to receive KRW 6 billion in funding from Shinhan Investment Corp., Investment Arm	19-04-02	CI
WINPAC Inc. announced that it has received KRW 4.5 billion in funding from Sensona Inc.	17-08-16	CI
WINPAC Inc. announced that it expects to receive KRW 4.5 billion in funding from Sensona Inc.	17-08-13	CI
WINPAC Inc. cancelled the acquisition of 7.39% stake in Transdermal Specialties Global Inc.	17-04-11	CI
WINPAC Inc. agreed to acquire 7.39% stake in Transdermal Specialties Global Inc. for KRW 4.6 billion.	16-04-11	CI
WINPAC Inc. announced that it has received KRW 13 billion in funding from Kell Cosmetics Co., Ltd., Heartnex Co., Ltd., KTB Network Co., Ltd., Incheon City Gas Co., Ltd., and other investors.	16-02-17	CI
Bum-Seok Oh acquired an additional 0.68% stake in WINPAC Inc. from DSC Dream First Private Equity Fund for KRW 670 million.	16-02-04	CI
Hye-Kyoung Yang, Sae-Hoon Yang and Soo-Hyun Choi acquired 2.73% stake in WINPAC Inc. from DSC Dream First Private Equity Fund for KRW 2.8 billion.	16-02-04	CI
Soo-Hyun Choi, Bum-Seok Oh and Soon-Jin Kim acquired 3.41% stake in WINPAC Inc. from DSC Dream First Private Equity Fund for KRW 3.4 billion.	16-02-04	CI
WINPAC Inc. announced that it expects to receive KRW 20 billion in funding from a group of investors.	16-02-03	CI
Kyoung-Hoon Lee acquired 2.75% stake in WINPAC Inc. from DSC Dream First Private Equity Fund for KRW 2.6 billion.	16-01-11	CI

Chart WINPAC Inc.

Duration

Period

More charts

Company Profile

WINPAC INC. is a Korea-based company mainly engaged in the semiconductor business. The Company provides package products and testing services. Its package products consist of fine pitch ball grid array (FBAG), land grid array (LGA), package on package (POP), flip chips, universal serial bus (USB) flash drive (UFD), solid state drive (SSD) and others. The Company offers testing on memory products, such as dynamic random-access memory (DRAM), static random-access memory (SRAM), flash and pseudo-static random-access memory (PSRAM). It also provides semiconductor test services. The Company provides its services with domestic market and to overseas markets.

Sector

Semiconductors

Calendar

2024-08-12 - Q2 2024 Earnings Release (Projected)

More about the company

Income Statement Evolution

More financial data

Sector Other Semiconductors

	1st Jan change	Capi.
WINPAC INC.	-27.48%	50.59M
NVIDIA CORPORATION	+83.40%	2,225B
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED	+38.11%	655B
BROADCOM INC.	+21.00%	620B
AMD (ADVANCED MICRO DEVICES)	+3.41%	243B
QUALCOMM, INC.	+29.74%	206B
TEXAS INSTRUMENTS INCORPORATED	+12.01%	171B
MICRON TECHNOLOGY, INC.	+44.48%	136B
INTEL CORPORATION	-38.75%	130B
ARM HOLDINGS PLC	+55.97%	122B

Other Semiconductors

WINPAC Inc.

Equities

A097800

KR7097800007

Semiconductors

WINPAC Inc. announced that it expects to receive KRW 18.564682948 billion in funding

Latest news about WINPAC Inc.

Chart WINPAC Inc.

Company Profile

Income Statement Evolution

Sector Other Semiconductors