Ventec International : Announcement on behalf of Ventec Electronics (HK) Company Limited under the Article 22-1-2&22-1-3 of Regulations Governing Loaning of Funds
Announcement on behalf of Ventec Electronics
(HK) Company Limited under the Article 22-1-2&22-1-3
of Regulations Governing Loaning of Funds
Date of events
2022/04/27
To which item it meets
paragraph 23
Statement
1.Date of occurrence of the event:2022/04/27
2.Funding recipient name, relationship with lender, lending limit
(thousand NTD), starting outstanding balance (thousand NTD), new loan
(thousand NTD), is it part of a scheduled allocation or revolving limit for
the same recipient that the chairman is authorized by the board of directors
to allocate, outstanding balance (thousand NTD) up to the date of
occurrence, reason for new loan (thousand NTD):
i. The first:
(1)Name: Ventec International Group Limited(SAMOA)
(2)Relationship with lender: For the Company(Ventec International Group
Co., Ltd.) directly or indirectly owned 100% of foreign subsidiaries.
(3)Lending limit (thousand NTD): NT$ 3,327,660 Thousand
(4)Starting outstanding balance (thousand NTD):NT$0
(5)New loan (thousand NTD): NT$ 400,750 Thousand
(6)Is it part of a scheduled allocation or revolving limit for the same
recipient that the chairman is authorized by the board of directors to
allocate: Yes.
(7)Outstanding balance (thousand NTD) up to the date of occurrence:
NT$400,750 Thousand
(8)Reason for new loan (thousand NTD): Working capital
ii. The second
(1)Name: Ventec Logistics Limited
(2)Relationship with lender: For the Company(Ventec International Group
Co., Ltd.) directly or indirectly owned 100% of foreign subsidiaries.
(3)Lending limit (thousand NTD): NT$ 3,327,660 Thousand
(4)Starting outstanding balance (thousand NTD):NT$0
(5)New loan (thousand NTD): NT$57,250 Thousand
(6)Is it part of a scheduled allocation or revolving limit for the same
recipient that the chairman is authorized by the board of directors to
allocate: Yes.
(7)Outstanding balance (thousand NTD) up to the date of occurrence:
NT$57,250 Thousand
(8)Reason for new loan (thousand NTD): Working capital
3.For collaterals provided by the loan recipient, the content and the value
(thousand NTD):None
4.For the latest financial reports of the loan recipient, the capital
(thousand NTD) and the cumulative gains/losses(thousand NTD):
(1) Capital (thousand NTD): NT$ 1,563,255 Thousand
(2) Cumulative gains/losses (thousand NTD): NT$ 1,173,883 Thousand
5.Method of calculation of interest:None
6.For repayment, the condition and the date:
Conditions: From the borrowing date, the principal will be repaid once due,
and it may be repaid in advance. Payment date:Due date is strating from the
first loan within 3 years
7.The amount of monetary loans extended to others as of the date of
occurrence (thousand NTD):NT$729,938 Thousand
8.The total amount of monetary loans extended to others as a percentage of
the public company's net worth on the latest financial statements as of the
date of occurrence:26.01%
9.Sources of funds for the company to extend monetary loans to others:
subsidiary itself
10.Any other matters that need to be specified:
i. The capital recently audited or reviewed:
Ventec International Group Limited(SAMOA):NT$1,333,944 Thousand
Ventec Logistics Limited: NT$229,311 Thousand
ii. The Cumulative gains/losses recently audited or reviewed:
Ventec International Group Limited(SAMOA): NT$1,369,306 Thousand
Ventec Logistics Limited: NT$ -195,423 Thousand
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Disclaimer
Ventec International Group Co. Ltd. published this content on 27 April 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 27 April 2022 06:14:06 UTC.
Ventec International Group Co.,Ltd. is a Cayman Islands incorporated company. The Company is mainly engaged in manufacturing and sale of adhesive sheet used for printing circuit boards, copper foil substrate and aluminum substrate. The Company's main products include copper foil substrate used for double-sided printed circuit board, Inner copper foil substrate and adhesive sheet used for multilayer printed circuit board, aluminum substrate and others.
Ventec International : Announcement on behalf of Ventec Electronics (HK) Company Limited under the Article 22-1-2&22-1-3 of Regulations Governing Loaning of Funds