Veeco Instruments

Q3 2023 Financial Results Conference Call - November 6th, 2023

1

Q3 2023 Financial Results Conference Call

Copyright © 2023 Veeco Instruments Inc. All Rights Reserved.

Safe Harbor

This presentation contains "forward-looking statements", within the meaning of the safe harbor provisions of the U.S. Private Securities Litigation Reform Act of 1995, as amended, that are based on management's expectations, estimates, projections and assumptions. Words such as "expects," "anticipates," "plans," "believes," "scheduled," "estimates" and variations of these words and similar

expressions are intended to identify forward-looking statements. Forward-looking statements include, but are not limited to, those

regarding anticipated growth and trends in our businesses and markets, industry outlooks and demand drivers, our investment and growth strategies, our development of new products and technologies, our business outlook for current and future periods, our ongoing transformation initiative and the effects thereof on our operations and financial results; and other statements that are not historical facts. These statements and their underlying assumptions are subject to risks and uncertainties and are not guarantees of future performance. Factors that could cause actual results to differ materially from those expressed or implied by such statements include, without limitation:

global trade issues, including the ongoing trade disputes between the U.S. and China, and changes in trade and export license policies; the

level of demand for our products; global economic and industry conditions; our dependency on third-party suppliers and outsourcing partners; the timing of customer orders; our ability to develop, deliver and support new products and technologies; our ability to expand our current markets, increase market share and develop new markets; the concentrated nature of our customer base; our ability to obtain and protect intellectual property rights in key technologies; the effects of regional or global health epidemics, including the effects of the COVID- 19 pandemic on the Company's operations and on those of our customers and suppliers; our ability to achieve the objectives of operational and strategic initiatives and attract, motivate and retain key employees; the variability of results among products and end-

markets, and our ability to accurately forecast future results, market conditions, and customer requirements; the impact of our

indebtedness, including our convertible senior notes and our capped call transactions; and other risks and uncertainties described in our SEC filings on Forms 10-K,10-Q and 8-K, and from time-to-time in our other SEC reports. All forward-looking statements speak only to management's expectations, estimates, projections and assumptions as of the date of this presentation. The Company does not undertake any obligation to update or publicly revise any forward-looking statements to reflect events, circumstances or changes in expectations after the date of this presentation.

2 Q3 2023 Financial Results Conference Call

Copyright © 2023 Veeco Instruments Inc. All Rights Reserved.

CEO Overview

and Business

Update

Bill Miller, Ph.D.

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Q3 2023 Financial Results Conference Call

Copyright © 2023 Veeco Instruments Inc. All Rights Reserved.

Q3 Financial & Business Highlights

Revenue

Non-GAAP

Operating Income

Diluted

Non-GAAP EPS

$177M

$33M

0.53¢

  • Top and bottom-line results above high-end of guidance
  • Semiconductor revenue remains elevated
  • Sequential growth in Data Storage
  • Shipped LSA systems to Tier 1 Logic and Memory customers
  • New application wins:
    • LSA in automotive
    • LDD IBD for EUV pellicles
  • Further progress with new NSA and IBD products

Robust results driven by Semiconductor strength and sequential growth in Data Storage

LDD - Low Defect Density

LSA - Laser Spike Annealing

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Q3 2023 Financial Results Conference Call

IBD - Ion Beam Deposition

NSA - Nanosecond Spike Annealing

EUV - Extreme Ultraviolet

Copyright © 2023 Veeco Instruments Inc. All Rights Reserved.

Market Update

Semiconductor strength driven by broad demand for LSA systems. LSA adoption for new applications expected to drive future growth.

Compound Semiconductor opportunity driven by demand for epitaxy equipment for power electronics and photonics applications

Data Storage core technologies providing significant value for advanced node semiconductor applications. Expect year-over-year growth in 2023.

Core Technologies

LaserWet

Annealing Ion Beam Processing Lithography

Wet

Epitaxy Processing

Ion Beam

5 Q3 2023 Financial Results Conference Call

Copyright © 2023 Veeco Instruments Inc. All Rights Reserved.

Veeco Technologies for Artificial Intelligence

GPU

High-Bandwidth Memory (HBM) DRAM

Current PTOR

Current PTOR

Laser-Spike Annealing (LSA)

Laser-Spike Annealing (LSA)

IBD for EUV mask blanks

Additional Future Opportunities

Additional Future Opportunities

Nanosecond Annealing (NSA)

Nanosecond Annealing (NSA)

IBD for low resistivity metals

  • IBD for low resistivity metals

Illustration of typical AI chip

6 Q3 2023 Financial Results Conference Call

Copyright © 2023 Veeco Instruments Inc. All Rights Reserved.

Advanced Packaging

Current PTOR

  • Wet Processing for micro-bump flux clean
  • Lithography for Cu bumps

Additional Future Opportunities

  • Wet Processing for temporary bond clean

PTOR = Production Tool of Record

TSV = Through Silicon Via

GPU = Graphics Processing Unit

HBM - High-Bandwidth Memory

Nanosecond Annealing Opportunity

2000

NSA

(°C)

(nanosecond)

LSA

Temperature

1000

(sub millisecond)

Lamp based

(sub second)

100

Time

• Shipped 1st NSA500TM eval system to Tier 1 logic customer

• Solidifies Veeco's leadership in advanced laser annealing

technology and helps drive the Semi industry roadmap

• Opportunity to expand SAM in Logic and Memory

Low thermal budget steps like Backside Power Delivery

and Contact Anneal for advanced nodes

Material Modification steps like void removal,

recrystallization and grain growth

Heating Depth

Very

shallow

Heats full

wafer

Illustration of Wafer Cross Section

NSA

Lamp based

LSA

10nm-100nm

Full wafer

~100 μm

• Planning 2nd eval shipment to Tier 1 customer in Q4 & initial

HVM orders in late 2024 or 2025

Enabling technology with strong customer pull

SAM - Served Available Market

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Q3 2023 Financial Results Conference Call

HVM - High Volume Manufacturing

Copyright © 2023 Veeco Instruments Inc. All Rights Reserved.

Ion Beam Deposition- Advanced Node Semi Opportunity

Illustration of grain size and distribution

PVD

IBD

Non-uniform, randomly

Uniformly oriented large

oriented grains of small

grains = lowest resistivity

size

  • Leveraging decades of experience and core IBD technology in Semiconductor market
  • Innovative technology addresses gaps with traditional technologies
  • Lower resistance metals essential for device speed and performance
  • Promising Tier 1 customer data displaying significant advantages vs PVD
  • On track to ship two evaluations to Tier 1 customers

Adapting IBD technology for advanced node wafer level semiconductor applications

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Q3 2023 Financial Results Conference Call

PVD - Physical Vapor Deposition

Copyright © 2023 Veeco Instruments Inc. All Rights Reserved.

CFO Financial Review

John Kiernan

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Copyright © 2023 Veeco Instruments Inc. All Rights Reserved.

Q3 2023 Revenue by Market & Region

Revenue by Market

Revenue by Region

Data Storage

19%

APAC

Semiconductor

Compound

56% $177M

14%

Semiconductor

11%

Scientific &

Other

Revenue Trend ($M)

Q3 22

Q2 23

Q3 23

Semiconductor

100

106

98

Compound Semi

28

24

26

Data Storage

28

14

34

Scientific & Other

16

17

20

Total

172

162

177

United States

29%

33%

EMEA China

15% 23%

ROW is negligible

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Q3 2023 Financial Results Conference Call

Copyright © 2023 Veeco Instruments Inc. All Rights Reserved.

Amounts may not calculate precisely due to rounding.

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Veeco Instruments Inc. published this content on 06 November 2023 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 06 November 2023 21:24:27 UTC.