Taiwan Semiconductor Manufacturing : TSMC Board of Directors Meeting Resolutions
August 09, 2022 at 06:26 am
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TSMC Board of Directors Meeting Resolutions
HSINCHU, Taiwan, R.O.C., Aug. 9, 2022 - TSMC (TWSE: 2330, NYSE: TSM) today held a meeting of the Board of Directors, which passed the following resolutions:
Approved the distribution of a NT$2.75 per share cash dividend for the second quarter of 2022, and set December 21, 2022 as the record date for common stock shareholders entitled to participate in this cash dividend distribution, and the ex-dividend date for the common shares shall be December 15, 2022. As required by Article 165 of Taiwan's Company Law, the shareholders' register shall be closed for five days prior to the record date (December 17 through December 21, 2022) for registration transfer, and the dividend will be paid on January 12, 2023. In addition, the ex-dividend date for TSMC American Depositary Shares (ADSs) will be December 15, 2022. The record date for TSMC ADSs entitled to participate in this cash dividend distribution will be December 16, 2022.
Approved capital appropriations of approximately US$9,234.73 million for purposes including:
Installation and expansion of advanced technology capacity; 2) Installation of mature and specialty technology capacity.
Approved the provision of a guarantee to TSMC Arizona, a wholly-owned subsidiary of TSMC, for its issuance of US dollar-denominated senior unsecured corporate bonds for an amount not to exceed US$4 billion, to finance TSMC's capacity expansion.
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world's leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry's leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 291 distinct process technologies, and manufactured 12,302 products for 535 customers in 2021 by providing broadest range of advanced, specialty and advanced packaging technology services. TSMC is the first foundry to provide 5-nanometer production capabilities, the
most advanced semiconductor process technology available in the world. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.
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TSMC Spokesperson:
Media Contacts:
Wendell Huang
Nina Kao
Baker Li
Vice President and CFO
Head of Public Relations
Public Relations
Tel: 886-3-505-5901
Tel: 886-3-5636688 ext.7125036
Tel: 886-3-5636688 ext.7125037
Mobile: 886-988-239-163
Mobile: 886-988-932-757
E-Mail: nina_kao@tsmc.com
E-Mail: baker_li@tsmc.com
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TSMC - Taiwan Semiconductor Manufacturing Company Ltd. published this content on 09 August 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 09 August 2022 10:25:06 UTC.
Taiwan Semiconductor Manufacturing Co Ltd is a Taiwan-based company mainly engaged in the provision of integrated circuit manufacturing services. The integrated circuit manufacturing services include process technology, special process technology, design ecosystem support, mask technology, 3DFabricTM advanced packaging and silicon stacking technology services. The Company has completed the transfer and mass production of 5nm technology, and is engaged in the research and development of 3nm process technology and 2nm process technology. The product application range covers the entire electronic application industry, including personal computers and peripheral products, information application products, wired and wireless communication system products, servers and data centers.