Taiwan IC Packaging Corporation is principally engaged in the packaging of integrated circuits (ICs). The Company operates its businesses through packaging of lead frame IC products, including thin small-outline packages (TSOPs), small-outline packages (SOPs) and quad flat packages (QFPs), as well as the packaging of advanced IC products, including thin IC packages and other products. Its products are applied in the manufacture of consumer electronics, computer peripheral products, power management products, drive components, mobile phones, wireless communication products, IC tags and memory cards for portable electronic products. The Company distributes its products primarily in Taiwan, America and Asia.
More about the company