Simmtech Holdings Co., Ltd. Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2023
August 11, 2023 at 03:03 am
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Simmtech Holdings Co., Ltd. reported earnings results for the second quarter and six months ended June 30, 2023. For the second quarter, the company reported sales was KRW 269,610.25 million compared to KRW 477,483.58 million a year ago. Net loss was KRW 35,038.49 million compared to net income of KRW 9,446.1 million a year ago. Basic loss per share from continuing operations was KRW 598 compared to basic earnings per share from continuing operations of KRW 241 a year ago. Diluted loss per share from continuing operations was KRW 568 compared to diluted earnings per share from continuing operations of KRW 115 a year ago. Basic loss per share was KRW 598 compared to basic earnings per share of KRW 241 a year ago. Diluted loss per share was KRW 568 compared to diluted earnings per share of KRW 115 a year ago.
For the six months, sales was KRW 487,246.05 million compared to KRW 894,890.74 million a year ago. Net loss was KRW 55,511.72 million compared to net income of KRW 26,680.61 million a year ago. Basic loss per share from continuing operations was KRW 948 compared to basic earnings per share from continuing operations of KRW 683 a year ago. Diluted loss per share from continuing operations was KRW 816 compared to diluted earnings per share from continuing operations of KRW 460 a year ago. Basic loss per share was KRW 948 compared to basic earnings per share of KRW 683 a year ago. Diluted loss per share was KRW 816 compared to diluted earnings per share of KRW 460 a year ago.
SIMMTECH HOLDINGS Co., Ltd., formerly SIMMTECH Co., Ltd., is a Korea-based company engaged in the manufacture of printed circuit boards (PCBs). The Companyâs products mainly consist of main boards and package substrates. Its main boards include memory module PCBs, which are used for desktop personal computers (PCs), notebook PCs, servers and others; mobile phone boards, which are used for mobile phones, mobile Internet devices, navigations and others; solid state drive (SSD) module PCBs, and other multilayer PCBs, among others. Its package substrates are used for integrating semiconductor chips. It also produces build-up PCBs for telecommunication terminal devices, repeaters and Internet devices, as well as burn-in boards (BIBs) used for burn-in tests.