Seika Corporation announced dividend of JPY 60.00 per share for the second quarter ended September 2023 compared to JPY 35.00 per share paid a year ago. Dividend payable date is December 11, 2023.

The company expects to pay year end dividend of JPY 60.00 per share for the year ending March 2024 compared to JPY 55.00 per share paid a year ago.