Intrinsyc Technologies Corporation announced the Open-Q™ 845 µSOM (micro System on Module) and Development Kit, to be available in the fourth quarter of 2019. The Open-Q™ 845 µSOM is the latest product in the evolution of Intrinsyc’s µSOM computing module series. It is an ultra-compact (50mm x 25mm), production-ready embedded module, ideal for powering the most advanced robotics, drones, cameras, and embedded IoT devices requiring the latest on-device AI powers. Featuring the Qualcomm® SDA845 system on chip (SoC) from Qualcomm Technologies Inc., the 845 µSOM integrates many new features and capabilities in the same small form-factor: Higher performing Octa-core CPU – up to 2.6GHz on Gold cores. New hardware-based security layers for vault-like defense. Third generation Qualcomm® AI platform for immersive, on-device intelligence. Four camera ports with flexible configurations supports up to 7 cameras. New camera architecture for cinema grade video capture. DisplayPort 4K60 via USB Type-C with USB super-speed data concurrency. Additional USB3.1 port for device connectivity while using DisplayPort. Gen3 PCIe interface. This powerful new hardware platform will be supported by user choice of full-featured Android 9 or Yocto Linux operating systems, with plans for offering Android 10 by Second Quarter next year. The Android 9 operating system will be shipped on the development kit and is an ideal starting point for evaluation of the SOM and to kick-start user product development. If user prefer a Linux OS, that will be available to download from Intrinsyc and program onto user development kit. Full software documentation will also be included with purchase of the development kit.