Infineon Technologies : EiceDRIVER™ 1EDB single-channel gate-driver IC family with integrated galvanic isolation in small 150 mil 8-pin DSO package
June 01, 2021 at 03:42 am
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EiceDRIVER™ 1EDB single-channel gate-driver IC family with integrated galvanic isolation in small 150 mil 8-pin DSO package
Jun 1, 2021| Market News
Munich, Germany - 1 June 2021 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its growing portfolio of single-channel gate-driver ICs. The new EiceDRIVER™ 1EDB family of single-channel gate-driver IC provides galvanic input-to-output isolation of 3 kV rms (UL 1577) that ensures rugged ground-loop separation. Their common-mode transient immunity (CMTI) exceeds 300 V/ns, making these devices the perfect choice for hard switching applications enabling numerous topologies.
The new 1EDB family includes four parts (1EDB6275F, 1EDB7275F, 1EDB8275F and 1EDB9275F) and is optimized for both high/low-side applications. They can solve PCB-layout problems, common in high-power applications such as server and telecomswitched-mode power supplies (SMPS) as well as uninterruptable power supply (UPS) systems. Due to their increased power-density need, EV-charging designs often require fast-switching power MOSFETs. Photovoltaic inverters take advantage of silicon carbide MOSFETs as they enable both lower switching losses and a significant step forward in power density. The new 1EDB family addresses all these applications, ensuring high system efficiency and robust and safe system operation.
All products come with separate and very low ohmic (0.95 Ω) source and (0.48 Ω) sink outputs for ease of design, offering typical drive strengths of 5.4 A peak source and 9.8 A peak sink. This feature plays a vital role in reducing the switching losses of power MOSFETs. The input-to-output propagation delay accuracy is +/- 4 ns helping to cut switching losses, which is essential in fast-switching applications. The typical output stage clamping speed is as short as 20 ns and supports functionally safe system operation, especially during start-up.
Designers can choose between four different output under-voltage lockout (UVLO) options:
0 V for logic-level MOSFETs (1EDB7275F)
0 V for normal-level MOSFETs (1EDB8275F)
12 V for CoolSiC™ MOSFETs 650 V (15 V driving scheme, 1EDB6275F)
14 V for CoolSiC™ MOSFETs 650 V (≥18 V driving scheme, 1EDB9275F)
Availability
EiceDRIVERs 1EDB7275F and 1EDB8275F are available in 150 mil 8-pin DSO packages and can be ordered now. Variants 1EDB6275F and 1EDB9275F will follow shortly. Further information can be found at www.infineon.com/1EDB
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Information Number
INFPSS202106-075
Press Photos
The EiceDRIVER™ 1EDB family comes with separate and very low ohmic (0.95 Ω) source and (0.48 Ω) sink outputs for ease of design, offering typical drive strengths of 5.4 Apeak source and 9.8 Apeak sink. The input-to-output propagation delay accuracy is +/- 4 ns helping to cut switching losses, which is essential in fast-switching applications. The typical output stage clamping speed is as short as 20 ns and supports functionally safe system operation, especially during start-up.
EiceDRIVER_1EDB_DSO-8-3
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Infineon Technologies AG published this content on 01 June 2021 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 01 June 2021 07:41:05 UTC.
Infineon Technologies AG is one of the world's leading manufacturers of semiconductors. The group's products include power semiconductors, sensors, microcontrollers, digital, mixed-signal and analog ICs, discrete semiconductor modules, switches, interface ICs, motor-controlling ICs, RF power transistors, voltage regulators, and electronic safety components. Net sales break down by area of activity as follows:
- automotive (50.5%): semiconductor products used in the automotive industry, and memory products for specific applications for automotive, industrial, information technologies, telecommunications and consumer electronics.
- power & sensor systems (23.3%): semiconductors for energy-efficient power supplies, mobile devices, mobile phone network infrastructures, human-machine interaction as well as applications with special demands on their robustness and reliability.
- industrial power control (13.5%): semiconductor products for the conversion of electrical energy for small, medium and high-power applications, used in the manufacturing, the low-loss transmission, the storage and the efficient use of electrical energy;
- connected secure systems (12.6%): semiconductors for networked devices, card-based applications, and government documents; microcontrollers for industrial, entertainment, and household applications, components for connectivity systems, various customer support systems;
- other (0.1%).
Net sales are distributed geographically as follows: Germany (12.4%), Europe/Middle East/Africa (14.4%), China/Hong Kong/Taiwan (32.3%), Japan (10.5%), Asia/Pacific (15.9%), the United States (12.1%) and Americas (2.4%).