Dongguan Hezhong Thermal Conduction Technology Co., Ltd. announced that it has received CNY 45,000,000 in an equity round of funding from returning investor Huizhou Speed Wireless Technology Co.,Ltd. on December 13, 2021. The transaction has been approved at the 28th extraordinary meeting of the 4th directorate, the 22nd extraordinary meeting of the 4th supervisory board, and the 5th extraordinary shareholders meeting of 2021 of Huizhou Speed Wireless Technology Co.,Ltd.