EM Networks Corp, formerly ESMO Materials Corp, is a Korea-based company mainly engaged in the provision of plastic resins materials used for semiconductors. The Company's product portfolio consists of epoxy molding compound (EMC), printable die attach adhesives, clear molding compound (CMC), white epoxy molding compound and silicone encapsulant, which are used for semiconductors and light emitting diodes (LEDs), as well as underfill resin for chip-on-films (COFs). The Company's products are sold under the brand name of LEMOCOM. The Company distributes its products in domestic and overseas markets.
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