DFI in collaboration with embedded computer system solution partner Hectronic, is making its debut appearance at the biennial Defense and Security Equipment International (DSEI), the defense and security technology exhibition. DFI will not only be presenting the 19-inch custom encrypted communication product developed in conjunction with Hectronic but also will be bringing a series of rugged products including industrial-grade embedded motherboards, system on module (SOM) solutions, and embedded systems. This collaboration not only demonstrates the R&D prowess of both companies but also highlights the achievements in strengthening the application ecosystem. Addressing information security, the 19-inch custom encrypted communication device jointly developed by DFI and Hectronic features an innovative "intrusion detection" design.

It incorporates a Trusted Platform Module (TPM) in line with international security standards for dedicated secure cryptographic processing, thereby reinforcing device security. Furthermore, among the array of rugged products exhibited by DFI, aside from meeting the general specifications demanded of military products such as wide temperature ranges, high stability, and versatile built-in interfaces, they also bring solutions enabling edge computing applications. This includes the recently-introduced rugged x86 IPC ECX700-AL, the TGU9A2, TGU968, and other TGU series SOM solutions powered by Intel's 11th generation processors.