Announcement pursuant to Article 25.1.(3) of the
Regulations Governing Loaning of Funds and Making of
Endorsements/Guarantees by Public Companies.
Date of events
2021/11/04
To which item it meets
paragraph 22
Statement
1.Date of occurrence of the event:2021/11/04
2.For the company for whom the endorsements/guarantees were made, please
specify name of endorsed/guaranteed company, its relationship with
the Company providing endorsements/guarantees, the ceiling on the
endorsements/guarantees (thousand NTD), the original amount of
endorsements/guarantees (thousand NTD), the amount of the current additional
endorsements/guarantees (thousand NTD), the amount of
endorsements/guarantees as of the date of occurrence (thousand NTD), the
actual loaned amount of the company for whom endorsements/guarantees were
made (thousand NTD), and the reason for the current additional
endorsements/guarantees:
HUATON HOLDINGS LIMITED.�F100% wholly owned subsidiary of the Company.
�F17,203,264�F0�F97,335�F97,335�F0�FThe Board Resolution about the amount of
guarantees.
3.For collaterals provided by the company for whom the
endorsements/guarantees were made, the content and the value (thousand NTD):
None
4.For the latest financial statements of the company for whom the
endorsements/guarantees were made, the Capital (thousand NTD) and Cumulative
gains/losses (thousand NTD):6,711,084�F13,110,858
5.For termination of endorsement/guarantee obligations, the condition and
the date:According to the terms of the contract.
6.The total amount of the ceiling on endorsements/guarantees (thousand NTD):
34,406,528
7.The total amount of endorsements/guarantees as of the date of occurrence
(thousand NTD):16,469,082
8.The amount of endorsements/guarantees as a percentage of the
public company��s net worth on the latest financial report as of the date of
occurrence:57.44%
9.The aggregate amount of equity method investments,
endorsements/guarantees, and monetary loans extended to others as a
percentage of the public company��s net worth on the latest financial
statements:76.05%
10.Any other matters that need to be specified:None
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Compeq Manufacturing Co. Ltd. published this content on 04 November 2021 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 04 November 2021 07:01:11 UTC.
Compeq Manufacturing Co Ltd is a Taiwan-based company mainly engaged in the manufacture and sale of printed circuit boards (PCBs). The Company is engaged in the provision of regular multi-layered PCBs, high density interconnection (HDI) PCBs, high layer count (HLC) PCBs, flexible PCBs and rigid-flex PCBs. The smart phone PCBs are used in communication related handheld devices such as smart phones. The communication and network PCBs are used in communication and network related equipment such as routers, hubs, switches and base stations. The computer PCBs are used in servers, workstations, laptops, tablet computers, desktop computers and peripheral products. The PCBs for consumer electronics are used in liquid crystal display televisions, digital cameras and game consoles. The Company is also engaged in the provision of surface mounting technology (SMT) services. The Company operates within the domestic market and to overseas markets, including the United States, Asia and Europe.
COMPEQ MANUFACTURING CO., LTD. 
