Chipbond Technology Corporation announced change in the Company's President. Name of the previous position holder: Huoo-Wen Gau. Resume of the previous position holder: President of Chipbond Technology Corp.

Name of the new position holder: Cheng-Hung Shih. Resume of the new position holder: Senior Vice President of Chipbond Technology Corp. Circumstances of change: job relocation.

Reason for the change:. For operation purpose. Effective date of the new appointment: May 8, 2024.