Valuation : Chipbond Technology Corporation

Market Cap 136B 4.28B 3.69B 3.48B 3.17B 5.92B 404B 5.97B 41.16B 15.97B 207B 16.06B 15.71B 679B P/E 2026 *
32.4x
P/E 2027 * 25.8x
Enterprise Value 130B 4.11B 3.54B 3.34B 3.04B 5.68B 388B 5.73B 39.51B 15.33B 198B 15.42B 15.08B 652B EV / Sales 2026 *
5x
EV / Sales 2027 * 4.44x
Free-Float
80.56%
Yield 2026 *
1.73%
Yield 2027 * 2.49%
1 day-0.54%
1 week+7.99%
Current month+3.99%
1 month+40.38%
3 months-36.08%
6 months+223.01%
Current year+238.59%
1 week 171.5
Extreme 171.5
203
1 month 128
Extreme 128
203
Current year 50.2
Extreme 50.2
313.5
1 year 50.2
Extreme 50.2
313.5
3 years 50.2
Extreme 50.2
313.5
5 years 49.2
Extreme 49.2
313.5
10 years 40.55
Extreme 40.55
313.5
Manager TitleAgeSince
Chief Executive Officer - 2006-06-13
President - -
Director of Finance/CFO 60 2007-11-15
Director TitleAgeSince
Chairman - 1997-06-10
Director/Board Member - 2006-06-13
Director/Board Member - 2019-06-13
Change 5-day change 1-year change 3-year change Capi.($)
-0.54%+7.99%+242.40%+163.73% 4.31B
+3.21%+7.04%+31.40%+362.62% 5,251B
-2.25%-0.62%+104.72%+335.22% 1,997B
-0.66%+3.28%+23.14%+320.90% 1,759B
+2.43%+1.88%+706.95%+1,258.26% 1,054B
-4.73%-3.87%+530.08%+1,244.17% 899B
-0.55%-4.96%+181.58%+317.60% 750B
-3.86%-3.86% - - 506B
+1.21%+2.05%+271.95%+145.97% 467B
+0.02%-6.45%+77.47% - 251B
Average -0.94%-1.49%+241.08%+518.56% 1,294B
Weighted average by Cap. -0.68%+2.22%+154.48%+483.55%

Financials

2026 *2027 *
Net sales 26.06B 821M 708M 667M 608M 1.14B 77.51B 1.14B 7.89B 3.06B 39.63B 3.08B 3.01B 130B 29.16B 918M 792M 746M 680M 1.27B 86.72B 1.28B 8.83B 3.43B 44.34B 3.45B 3.37B 146B
Net income 4.17B 131M 113M 107M 97.14M 182M 12.39B 183M 1.26B 490M 6.34B 493M 482M 20.81B 5.26B 165M 143M 134M 123M 229M 15.63B 231M 1.59B 618M 7.99B 621M 608M 26.25B
Net Debt -5.44B -171M -148M -139M -127M -237M -16.19B -239M -1.65B -640M -8.28B -644M -630M -27.2B -6.53B -206M -177M -167M -152M -284M -19.42B -287M -1.98B -767M -9.93B -772M -755M -32.61B
Logo Chipbond Technology Corporation
Chipbond Technology Corp is a Taiwan-based company principally engaged in the research, development, manufacture, and distribution of electronic and semiconductor products, as well as the provision of related testing and assembling services. The Company provides products include gold bumps, solder bumps, chip on glass (COG), chip on film (COF) and flip chip and tape carrier packaging (TCP) products, among others. Its products are mainly used in the manufacture of computers, workstations, mobile phones, network products, air bag controllers, engine controlling components, automatic brake systems (ABSs), automobile air conditioners, digital cameras, watches, and liquid crystal display (LCD) monitors. The Company mainly distributes its products in Taiwan, the United States of America (the USA) and other regions.
Employees
-
Date Price Change Volume
26-09-02 NT$182.50 -0.54% 15,644,266
26-09-01 NT$183.50 +4.56% 23,238,950
26-08-31 NT$175.50 -3.84% 21,206,491
26-08-28 NT$182.50 -2.67% 53,168,281
26-08-27 NT$187.50 +1.08% 70,931,177
Trader
Investor
Global
Quality
ESG MSCI
BBB
Sell
Consensus
Buy
Mean consensus
OUTPERFORM
Number of Analysts
6
Last Close Price
182.50TWD
Average target price
230.67TWD
Spread / Average Target
+26.39%

Quarterly revenue - Rate of surprise

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