On April 15, 2022, Automobile & PCB Inc. closed the transaction. The company amended the terms of the transaction and has issued series 20 bonds for KRW 12,000,000,000. The bonds will mature on April 15, 2025.
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5-day change | 1st Jan Change | ||
840 KRW | -4.11% |
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-6.77% | -37.78% |
1st Jan change | Capi. | |
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-37.78% | 28.53M | |
+39.41% | 68.59B | |
-6.60% | 17.1B | |
+75.63% | 12.63B | |
+19.92% | 11.35B | |
+8.82% | 9.97B | |
+69.30% | 9.61B | |
+1.99% | 8.44B | |
-3.75% | 7.93B | |
+49.56% | 7.46B |
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- News Automobile & PCB Inc.
- Automobile & PCB Inc. announced that it has received KRW 12 billion in funding from Ellim Corporation Co., Ltd.