Aehr Test Systems announced it has received a follow-on production order from its second major silicon carbide semiconductor customer for an additional production FOX-XPTM multi-wafer test and burn-in system configured with Aehr's fully integrated and automated WaferPakTM Aligner. The FOX-XP system is configured with Bipolar Voltage Channel Module (BVCM) and Very High Voltage Channel Module (VHVCM) options that enable new advanced test and burn-in capabilities for silicon carbide power semiconductors using Aehr's proprietary WaferPak full wafer Contactors. This customer serves several significant markets including the electric vehicle industry as well as other industrial applications.

The FOX-XP system with integrated WaferPak Aligner is expected to ship in Aehr's fiscal fourth quarter that begins March 1, 2023.