Bao Zeng Wang
Director/Board Member at Henghui Technology Corp. Ltd.
Profile
Bao Zeng Wang is currently a Member-Supervisory Board at HENGHUI Technology Corp.
Ltd.
His education history includes being a graduate from Southeast University.
Bao Zeng Wang active positions
| Companies | Position | Start |
|---|---|---|
Henghui Technology Corp. Ltd.
 Henghui Technology Corp. Ltd. Metal FabricationProducer Manufacturing HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China. | Director/Board Member | 2020-10-31 |
Training of Bao Zeng Wang
| Southeast University | Graduate Degree |
Experiences
Positions held
Connections
1st degree connections
1st degree companies
Male
Female
Members of the board
Executives
Linked companies
| Private companies | 1 |
|---|---|
Henghui Technology Corp. Ltd.
Henghui Technology Corp. Ltd. Metal FabricationProducer Manufacturing HENGHUI Technology Corp. Ltd. engages in the research, development, production, and sale of chip packaging materials. It is involved in the smart card, etching lead frame, and IoT eSIM chip packaging and testing business. The company provides flexible lead frame products, smart card module products, incoming material packaging and testing services, and wafer reduction services. HENGHUI Technology was founded on December 7, 2017 and is headquartered in Zibo, China. | Producer Manufacturing |
- Stock Market
- Insiders
- Bao Zeng Wang
