Vishay Intertechnology Inc. introduced a new series of 45 A to 100 A three-phase-bridge power modules in the low-profile MTP PressFit package. Compared to devices incorporating solder contact technology, the VS`40MT160P-P, VS-70MT160P-P, and VS-100MT160P-P dramatically lower production costs and increase reliability for welding machines, UPS, switch mode power supplies, and motor drives. The solderless PressFit technology of the power modules released allows for easy one-step PCB mounting to significantly reduce assembly time while simplifying in-field maintenance.

Offering direct mounting to heatsinks, the devices low 17 mm profile maximizes space savings while optimizing electrical layouts for application-specific power supplies.