Ventec International : Announce on Behalf of Ventec Electronics (Suzhou) Co., Ltd. of Its Board Resolution to Increase Capital by Issuing New Shares from Earnings
Announce on Behalf of Ventec Electronics
(Suzhou) Co., Ltd. of Its Board Resolution to
Increase Capital by Issuing New Shares from Earnings
Date of events
2022/05/24
To which item it meets
paragraph 11
Statement
1.Date of the board of directors resolution:2022/05/24
2.Source of capital increase funds:Capitalization of Earnings
3.Whether to adopt shelf registration (Yes, please state issuance period/No):
NA
4.Total monetary value of the issuance and number of shares issued (shares
issued not including those distributed to employees if consisting in
capital increase from earnings or capital surplus):
monetary value,US$ 1.5 million(RMB $9,523,000)/number of shares,NA
5.If adopting shelf registration, monetary value and number of shares
to be issued this time:NA
6.The remaining monetary value and shares after this issuance when
adopting shelf registration:NA
7.Par value per share:NA
8.Issue price:NA
9.Number of shares subscribed for by or allocated to employees:NA
10.Number of shares publicly sold:NA
11.Ratio of shares subscribed by or allotted as stock dividends to existing
shareholders:NA
12.Handling method for fractional shares and shares unsubscripted for by
the deadline:NA
13.Rights and obligations of these newly issued shares:NA
14.Utilization of the funds from the capital increase:
Strengthen the Capital Structure.
15.Any other matters that need to be specified:None
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Disclaimer
Ventec International Group Co. Ltd. published this content on 24 May 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 24 May 2022 09:17:03 UTC.
Ventec International Group Co.,Ltd. is a Cayman Islands incorporated company. The Company is mainly engaged in manufacturing and sale of adhesive sheet used for printing circuit boards, copper foil substrate and aluminum substrate. The Company's main products include copper foil substrate used for double-sided printed circuit board, Inner copper foil substrate and adhesive sheet used for multilayer printed circuit board, aluminum substrate and others.
Ventec International : Announce on Behalf of Ventec Electronics (Suzhou) Co., Ltd. of Its Board Resolution to Increase Capital by Issuing New Shares from Earnings