Vanguard International Semiconductor : 5/3, 1Q23 Presentation Material
May 03, 2023 at 03:41 am
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VANGUARD
2023 First Quarter Results
Investor Conference
May 3, 2023
Agenda
Welcome
1Q23 Consolidated Financial Results
Remark
Q & A
1Q23 Investor Conference - 2
Disclaimer
This presentation material contains certain forward-looking statements that are based on current expectations and are subject to known and unknown risks and uncertainties that could cause actual results to differ materially from those expressed or implied by such statements.
1Q23 Investor Conference - 3
1Q23 Result Highlights
Amount : NT$ Million
1Q23
4Q22
1Q22
Amount
Amount
Amount
Net Revenue
8,187
9,573
13,492
Net Income
1,364
2,479
4,092
EPS (NT$)
0.82
1.47
2.47
Cash and Financial Instruments
33,927
34,843
32,452
Equity
46,613
45,351
39,960
Total Wafers Shipped (Kpcs)
414
441
757
1Q23 Investor Conference - 4
Statements of Comprehensive Income
Amount: NT$Million
Selected Items from
Statements of Comprehensive Income
Net Revenue
Cost of Revenue
Gross Profit
Operating Expenses
Operating Income
Net Non-operating Income Income before Income Tax Net Income
Diluted EPS (NT$)
1Q23
4Q22
1Q22
QoQ
YoY
Amount
%
Amount
%
Amount
%
%
%
8,187
100.0
9,573
100.0
13,492
100.0
(14.5)
(39.3)
(5,728)
(70.0)
(5,819)
(60.8)
(6,966)
(51.6)
(1.6)
(17.8)
2,459
30.0
3,755
39.2
6,526
48.4
(34.5)
(62.3)
(1,093)
(1,292)
(13.5)
(1,538)
(11.4)
(15.4)
(28.9)
(13.4)
1,365
16.7
2,462
25.7
4,988
37.0
(44.5)
(72.6)
335
4.1
445
4.6
83
0.6
(24.8)
302.1
1,700
20.8
2,907
30.4
5,071
37.6
(41.5)
(66.5)
1,364
16.7
2,479
25.9
4,092
30.3
(45.0)
(66.7)
0.82
1.47
2.47
(44.2)
(66.8)
1Q23 Investor Conference - 5
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VIS - Vanguard International Semiconductor Corporation published this content on 03 May 2023 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 03 May 2023 07:40:03 UTC.
Vanguard International Semiconductor Corporation is a Taiwan-based integrated circuit (IC) foundry service provider. The Company provides wafer foundry services, including complementary metal-oxide semiconductor (CMOS), general logic ICs, high voltage ICs, mixed signal ICs, analog ICs, radio frequency (RF) ICs, ultra-low power CMOS ICs, bipolar-CMOS-double diffused metal-oxide semiconductor (DMOS) and CMOS image sensor processing services. It also provides multiple project wafer (MPW) services, mask services and design services. The Companyâs products and services are applied in the manufacture of computers and peripheral products, communication products and consumer electronics, such as liquid crystal display (LCD) monitors, mobile phones, local area network (LAN) devices, switches, handheld navigation products, digital televisions (TVs) and others.