Xiamen Tongfu Microelectronics Co., Ltd. announced that it will raise CNY 200 million in a round of funding on July 25, 2022. The transaction will include participation from returning investor, Tongfu Microelectronics Co.,Ltd. Post the transaction, the registered capital of the company will increase from CNY 800 million to CNY 1,000 million and Tongfu Microelectronics Co.,Ltd.'s stake will increase from 10% to 28% and Xiamen Semiconductor Investment Group Co., Ltd.'s stake will decrease from 90% to 72%. The transaction has been approved in the 15th meeting of the 7th Board of Directors of the investor.
End-of-day quote
Other stock markets
|
5-day change | 1st Jan Change | ||
22.97 CNY | -3.32% | +11.18% | -0.65% |
05-28 | Malaysia targets over $100 bln in semiconductor industry investment | RE |
05-15 | Chinese firms make headway in producing high bandwidth memory for AI chipsets | RE |
EPS Revisions
1st Jan change | Capi. | |
---|---|---|
-0.65% | 4.8B | |
+30.66% | 102B | |
+10.76% | 24.95B | |
+8.93% | 23.23B | |
+29.84% | 22B | |
-3.99% | 3.62B | |
+3.89% | 3.32B | |
-25.24% | 2.46B | |
+20.71% | 1.11B | |
-1.89% | 1.06B |
- Stock Market
- Equities
- 002156 Stock
- News Tongfu Microelectronics Co.,Ltd
- Xiamen Tongfu Microelectronics Co., Ltd. announced that it expects to receive CNY 200 million in funding from Tongfu Microelectronics Co.,Ltd