Xiamen Tongfu Microelectronics Co., Ltd. announced that it will raise CNY 200 million in a round of funding on July 25, 2022. The transaction will include participation from returning investor, Tongfu Microelectronics Co.,Ltd. Post the transaction, the registered capital of the company will increase from CNY 800 million to CNY 1,000 million and Tongfu Microelectronics Co.,Ltd.'s stake will increase from 10% to 28% and Xiamen Semiconductor Investment Group Co., Ltd.'s stake will decrease from 90% to 72%. The transaction has been approved in the 15th meeting of the 7th Board of Directors of the investor.