Tangshan Sanfu Electronic Materials Co., Ltd announced that it will receive CNY 170,000,000 in an equity round funding from existing investor Tangshan Sunfar Silicon Industries Co., Ltd. (SHSE:603938) on 17 January, 2018. The investor will maintain 100% stake in the company post the closing. The company's registered capital will increase from CNY 10,000,000 to CNY 180,000,000 post the closing of the transaction. The transaction has been approved by the investor at the 4th meeting of its 3rd directorate.